具有自x属性的可配置模拟前端的低成本间接测量节能现场优化:硬件实现

Q. Zaman, S. Alraho, A. König
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引用次数: 1

摘要

本文介绍了一种节能芯片性能优化的实际实现和测量结果,利用低成本的间接测量方法支持自x特性(自校准、自修复、自优化等),以XFAB 0.35µm互补金属氧化物半导体(CMOS)技术对模拟前端传感电子器件进行现场优化。可重构、全差分间接电流反馈仪表放大器(CFIA)的性能通过采用单一测试正弦信号刺激和测量输出端的总谐波失真(THD)而得到内在优化。为了增强优化过程,将经验回放粒子群优化(ERPSO)算法作为人工智能(AI)代理,在硬件层面实现,以优化CFIA的性能特征。ERPSO算法扩展了经典PSO方法的选择生产者能力,通过结合经验回放缓冲区来减少陷入局部最优的可能性。此外,CFIA电路集成了一个简单的功率监测模块,以评估优化解决方案的功耗,以实现节能和可靠的配置。优化后的芯片性能显示,在实现- 72 dB的目标THD值的同时,功率效率提高了约34%,使用频率为1 MHz的1 Vp-p差分输入信号,功耗约为53 mW。在预制芯片上进行的初步测试,使用从布局后模拟推断的默认配置模式,揭示了CFIA的不可接受的性能行为。然而,提出的现场优化成功地恢复了电路的性能,从而实现了满足设计阶段性能的稳健设计。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Low-Cost Indirect Measurements for Power-Efficient In-Field Optimization of Configurable Analog Front-Ends with Self-X Properties: A Hardware Implementation
This paper presents a practical implementation and measurement results of power-efficient chip performance optimization, utilizing low-cost indirect measurement methods to support self-X properties (self-calibration, self-healing, self-optimization, etc.) for in-field optimization of analog front-end sensory electronics with XFAB 0.35 µm complementary metal oxide semiconductor (CMOS) technology. The reconfigurable, fully differential indirect current-feedback instrumentation amplifier (CFIA) performance is intrinsically optimized by employing a single test sinusoidal signal stimulus and measuring the total harmonic distortion (THD) at the output. To enhance the optimization process, the experience replay particle swarm optimization (ERPSO) algorithm is utilized as an artificial intelligence (AI) agent, implemented at the hardware level, to optimize the performance characteristics of the CFIA. The ERPSO algorithm extends the selection producer capabilities of the classical PSO methodology by incorporating an experience replay buffer to mitigate the likelihood of being trapped in local optima. Furthermore, the CFIA circuit has been integrated with a simple power-monitoring module to assess the power consumption of the optimization solution, to achieve a power-efficient and reliable configuration. The optimized chip performance showed an approximate 34% increase in power efficiency while achieving a targeted THD value of −72 dB, utilizing a 1 Vp-p differential input signal with a frequency of 1 MHz, and consuming approximately 53 mW of power. Preliminary tests conducted on the fabricated chip, using the default configuration pattern extrapolated from post-layout simulations, revealed an unacceptable performance behavior of the CFIA. Nevertheless, the proposed in-field optimization successfully restored the circuit’s performance, resulting in a robust design that meets the performance achieved in the design phase.
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