V. Boppana, Sagheer Ahmad, I. Ganusov, Vinod Kathail, V. Rajagopalan, Ralph Wittig
{"title":"UltraScale+ MPSoC和FPGA系列","authors":"V. Boppana, Sagheer Ahmad, I. Ganusov, Vinod Kathail, V. Rajagopalan, Ralph Wittig","doi":"10.1109/HOTCHIPS.2015.7477457","DOIUrl":null,"url":null,"abstract":"This article consists of a collection of slides from the authors' conference presentation. Zynq UltraScale+ MPSoC: 2nd Generation SoC from Xilinx - Applications processing, Real-time, Graphics, Video, Serial connectivity - Power management, Safety, Security - SDSoC: Full system optimizing compiler; More than Moore: Architectural innovation - 3x CPU performance and 4.5x memory bandwidth (SoC) -UltraScale+ fabric: 60% higher performance, 2.5x performance/watt (FPGA) - 3rd generation of silicon interposer technology (3D IC); Taped out in Jun 2015 on TSMC 16FF+ - Significant power and performance benefits with 3D FinFet transistors - Diverse SW and systems running on multiple platforms today.","PeriodicalId":6666,"journal":{"name":"2015 IEEE Hot Chips 27 Symposium (HCS)","volume":"145 1","pages":"1-37"},"PeriodicalIF":0.0000,"publicationDate":"2015-08-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"32","resultStr":"{\"title\":\"UltraScale+ MPSoC and FPGA families\",\"authors\":\"V. Boppana, Sagheer Ahmad, I. Ganusov, Vinod Kathail, V. Rajagopalan, Ralph Wittig\",\"doi\":\"10.1109/HOTCHIPS.2015.7477457\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"This article consists of a collection of slides from the authors' conference presentation. Zynq UltraScale+ MPSoC: 2nd Generation SoC from Xilinx - Applications processing, Real-time, Graphics, Video, Serial connectivity - Power management, Safety, Security - SDSoC: Full system optimizing compiler; More than Moore: Architectural innovation - 3x CPU performance and 4.5x memory bandwidth (SoC) -UltraScale+ fabric: 60% higher performance, 2.5x performance/watt (FPGA) - 3rd generation of silicon interposer technology (3D IC); Taped out in Jun 2015 on TSMC 16FF+ - Significant power and performance benefits with 3D FinFet transistors - Diverse SW and systems running on multiple platforms today.\",\"PeriodicalId\":6666,\"journal\":{\"name\":\"2015 IEEE Hot Chips 27 Symposium (HCS)\",\"volume\":\"145 1\",\"pages\":\"1-37\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2015-08-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"32\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2015 IEEE Hot Chips 27 Symposium (HCS)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/HOTCHIPS.2015.7477457\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2015 IEEE Hot Chips 27 Symposium (HCS)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/HOTCHIPS.2015.7477457","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
This article consists of a collection of slides from the authors' conference presentation. Zynq UltraScale+ MPSoC: 2nd Generation SoC from Xilinx - Applications processing, Real-time, Graphics, Video, Serial connectivity - Power management, Safety, Security - SDSoC: Full system optimizing compiler; More than Moore: Architectural innovation - 3x CPU performance and 4.5x memory bandwidth (SoC) -UltraScale+ fabric: 60% higher performance, 2.5x performance/watt (FPGA) - 3rd generation of silicon interposer technology (3D IC); Taped out in Jun 2015 on TSMC 16FF+ - Significant power and performance benefits with 3D FinFet transistors - Diverse SW and systems running on multiple platforms today.