后硅验证的机遇、挑战和最新进展

S. Mitra, S. Seshia, N. Nicolici
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引用次数: 156

摘要

后硅验证用于检测和修复集成电路和系统在制造后的缺陷。由于设计的复杂性,几乎不可能在生产前检测和修复所有错误。后硅验证是未来系统的主要挑战。今天,它在很大程度上被视为一门艺术,几乎没有系统的解决方案。因此,后硅验证是一个新兴的研究课题,为电子设计自动化的重大创新提供了几个令人兴奋的机会。在本文中,我们提供了硅后验证问题的概述,以及它与传统的硅前验证和制造测试的区别。我们还讨论了主要的后硅验证挑战和最近的进展。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Post-silicon validation opportunities, challenges and recent advances
Post-silicon validation is used to detect and fix bugs in integrated circuits and systems after manufacture. Due to sheer design complexity, it is nearly impossible to detect and fix all bugs before manufacture. Post-silicon validation is a major challenge for future systems. Today, it is largely viewed as an art with very few systematic solutions. As a result, post-silicon validation is an emerging research topic with several exciting opportunities for major innovations in electronic design automation. In this paper, we provide an overview of the post-silicon validation problem and how it differs from traditional pre-silicon verification and manufacturing testing. We also discuss major postsilicon validation challenges and recent advances.
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