温度相关MOSFET老化的建模

F. A. Herrera, M. Miura-Mattausch, H. Kikuchihara, T. Iizuka, H. Mattausch, H. Takatsuka
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引用次数: 2

摘要

我们建立了基于陷阱密度增加的mosfet器件老化模型,它包含在泊松方程中,以明确地和物理上正确地考虑老化。为了保持一致性,对泊松方程进行迭代求解。通过将该老化模型应用于工业标准模型HiSIM,可以很好地再现老化I-V特性的温度依赖性。利用所建立的模型从测量中提取的物理器件量进行了研究,以表征老化特征。我们观察到,对于未老化和老化的器件,活化能Ea作为Vgs的函数几乎相同。这表明,老化的温度依赖性主要来自于温度依赖性静电势,导致提取陷阱密度Ntrap的温度依赖性可以忽略不计。为了推广这一结论,研究了增加应力诱导陷阱密度的双栅极MOSFET的二维器件模拟。从测量得到的结果是相同的,即活化能几乎是相同的,无论是未老化或老化的情况下。这表明,利用非老化器件的温度依赖I-V特性可以准确地预测器件老化的温度依赖关系。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Modeling of Temperature-Dependent MOSFET Aging
We have modeled MOSFET-device aging based on the trap-density increase, which is included in the Poisson equation to consider aging explicitly and physically correct. To preserve consistency, the Poisson equation is solved iteratively. Measured temperature dependence of aged I-V characteristics are well reproduced with implementation of this aging model into the industry-standard model HiSIM. The extracted physical device quantities with the developed model from measurements have been investigated to characterize the aging features. It is observed that the activation energy Ea as a function of Vgs is nearly identical for non-aged and aged devices. This concludes that the temperature dependence of aging originates mostly from the temperature-dependent electrostatic potential, resulting in negligible temperature dependency of extracted trap density Ntrap. To generalize the conclusion, 2D-device simulation is investigated for a double-gate (DG) MOSFET with increased stress-induced trap density. The same results as obtained from measurements are achieved, namely the activation energy is nearly identical for either non-aged or aged cases. This concludes that the temperature dependence of device aging can be accurately predicted using the temperature-dependent I-V characteristics of non-aged device.
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