聚焦Xe离子束铣削铌酸锂的超深微轴

S. Gorelick, A. Marco
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引用次数: 0

摘要

折射轴是一种锥形光学器件,能够在扩展焦深(DOFs)上产生非绕射类贝塞尔光束。除了与抛物面聚焦透镜相比具有更长的DOF外,对于相同的光学元件形状因素(例如其直径和凹陷高度),轴向透镜可以产生具有更好分辨率的光束。这些特性使轴突在成像、粒子捕获和许多其他应用中非常有用。由于缺乏足够精确和快速的制造技术,在硬基板上实现微型化折射轴或微轴具有挑战性。在这里,我们报道了利用高电流聚焦Xe离子束铣削在铌酸锂中快速制造超深微轴的方法。用200 nA的束流加工直径为230 μm、凹陷高度在21 ~ 48 μm之间的微轴。此外,微轴在单晶铌酸锂材料中研磨,铌酸锂材料具有>2.2的高折射率,但其惰性使其在微加工中具有挑战性。通过对不同位置透射光强的映射来表征透镜的性能。所产生光束的测量光斑尺寸与理论预期非常吻合,在本研究中,最浅微轴和最深微轴的光斑尺寸范围分别为750到250 nm (~ λ/2)。对于超深微轴,相应的DOFs范围为500 ~ ~ 50 μm。结果验证了聚焦Xe离子束大电流铣削技术在高性能光学元件制造中的适用性。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Ultradeep microaxicons in lithium niobate by focused Xe ion beam milling
Refractive axicons are conically shaped optical devices that are capable of generating nondiffracting Bessel-like beams over extended depths-of-focus (DOFs). In addition to the substantially longer DOF compared to those produced by parabolic focusing lenses, the axicons can generate beams with better resolution for the same form-factor of the optical element, e.g., its diameter and sag height. These properties make the axicons useful in numerous applications in imaging, particle trapping, and many others. Miniaturized refractive axicons or microaxicons are challenging to realize in hard substrates due to the lack of sufficiently precise and rapid fabrication technologies. Here, we report on the rapid fabrication of ultradeep microaxicons in lithium niobate using high-current focused Xe ion beam milling. Microaxicons with 230- μm diameter with ultradeep sag heights between 21 and 48  μm were milled using 200 nA of beam current. Furthermore, the microaxicons were milled in single-crystal lithium niobate—a material with a high refractive index of >2.2 but which inertness makes it a challenging material in microfabrication. The performance of the lenses was characterized by mapping the transmitted intensity at different positions. The measured spot sizes of the produced beams are in excellent agreement with the theoretical expectations and range from 750 down to 250 nm ( ∼λ/2) beam spot size for the shallowest and the deepest microaxicons in this study, respectively. The corresponding DOFs are from 500 down to ∼50  μm for the ultradeep microaxicon. The results verify the applicability of high-current milling with a focused Xe ion beam for the fabrication of high-performance optical elements.
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