低功率磁微致动用Cu-Ni纳米复合材料的合成与器件制作

Y. Huang, T. Chao, Y. Cheng
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引用次数: 1

摘要

本文提出了一种低功率磁微致动用Cu-Ni纳米复合膜及其CMOS兼容制备工艺。通过将Ni纳米颗粒掺入Cu基体中形成Cu-Ni纳米复合膜,可以将Cu的磁性从抗磁性转变为铁磁性。实验结果表明,用Cu- ni纳米复合材料代替纯Cu材料制成磁致微动线圈,可使磁致微动的功耗降低约9%。有效功率的降低可归因于线圈内部磁通密度的增强。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Synthesis and device fabrication of Cu-Ni nanocomposite for low power magnetic microactuation
This paper presents a Cu-Ni nanocomposite film and related CMOS compatible fabrication process using alkaline noncyanide based copper plating solution for low power magnetic microactuation application. The magnetic properties of Cu can be modified from diamagnetism to ferromagnetism via the incorporation of Ni nanoparticles into a Cu matrix to form a Cu-Ni nanocomposite film. Experimental results show that about 9% power consumption reduction of magnetic microactuation could be realized while the actuated coil is made of the Cu-Ni nanocomposite instead of pure Cu. The effective power reduction can be attributed to the magnetic flux density intensification inside the coil.
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