{"title":"高极化密度铁电Al:HfO2薄膜的快速热猝灭及其在闪存中的应用","authors":"B. Ku, Seonjun Choi, Y. Song, C. Choi","doi":"10.1109/VLSITechnology18217.2020.9265024","DOIUrl":null,"url":null,"abstract":"We have investigated the effects of post cooling process with chamber cooling, air cooling and fast quenching in DI water on the ferroelectric (FE) characteristics of Al-doped Hf0<inf>2</inf> (Al:HfO<inf>2</inf>) thin films and demonstrated their potential flash memory applications. Compared with other cooling processes, using fast quenching after annealing we achieved the drastic increase of remnant polarization <tex>$(\\mathrm{P}_{\\mathrm{r}})$</tex> and coercive electric field <tex>$(\\mathrm{E}_{\\mathrm{c}})$</tex>. The highest <tex>$2\\mathrm{P}_{\\mathrm{r}}$</tex> and <tex>$2\\mathrm{E}_{\\mathrm{c}}$</tex> are <tex>$\\sim 100\\mu\\mathrm{C}/\\mathrm{cm}^{2}$</tex> and ~9.5 MV/cm, respectively, the highest records among HfO<inf>2</inf>-based FE reported so far. These improvements are attributed to induce higher stress/strain within A1:HfO<inf>2</inf> thin film, leading to stable orthorhombic phase (o-phase). Program/erase up to 10<inf>6</inf> cycles and 10 years retention characteristics are also evaluated for the potential flash memory application. Our simulation with experimental data indicates that P<inf>r</inf> and E<inf>c</inf> significantly can influence on the memory window and multi-bit states, which can be tuned by our proposed quenching process.","PeriodicalId":6850,"journal":{"name":"2020 IEEE Symposium on VLSI Technology","volume":"4 1","pages":"1-2"},"PeriodicalIF":0.0000,"publicationDate":"2020-06-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"11","resultStr":"{\"title\":\"Fast Thermal Quenching on the Ferroelectric Al:HfO2 Thin Film with Record Polarization Density and Flash Memory Application\",\"authors\":\"B. Ku, Seonjun Choi, Y. Song, C. Choi\",\"doi\":\"10.1109/VLSITechnology18217.2020.9265024\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"We have investigated the effects of post cooling process with chamber cooling, air cooling and fast quenching in DI water on the ferroelectric (FE) characteristics of Al-doped Hf0<inf>2</inf> (Al:HfO<inf>2</inf>) thin films and demonstrated their potential flash memory applications. Compared with other cooling processes, using fast quenching after annealing we achieved the drastic increase of remnant polarization <tex>$(\\\\mathrm{P}_{\\\\mathrm{r}})$</tex> and coercive electric field <tex>$(\\\\mathrm{E}_{\\\\mathrm{c}})$</tex>. The highest <tex>$2\\\\mathrm{P}_{\\\\mathrm{r}}$</tex> and <tex>$2\\\\mathrm{E}_{\\\\mathrm{c}}$</tex> are <tex>$\\\\sim 100\\\\mu\\\\mathrm{C}/\\\\mathrm{cm}^{2}$</tex> and ~9.5 MV/cm, respectively, the highest records among HfO<inf>2</inf>-based FE reported so far. These improvements are attributed to induce higher stress/strain within A1:HfO<inf>2</inf> thin film, leading to stable orthorhombic phase (o-phase). Program/erase up to 10<inf>6</inf> cycles and 10 years retention characteristics are also evaluated for the potential flash memory application. Our simulation with experimental data indicates that P<inf>r</inf> and E<inf>c</inf> significantly can influence on the memory window and multi-bit states, which can be tuned by our proposed quenching process.\",\"PeriodicalId\":6850,\"journal\":{\"name\":\"2020 IEEE Symposium on VLSI Technology\",\"volume\":\"4 1\",\"pages\":\"1-2\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2020-06-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"11\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2020 IEEE Symposium on VLSI Technology\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/VLSITechnology18217.2020.9265024\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2020 IEEE Symposium on VLSI Technology","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/VLSITechnology18217.2020.9265024","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Fast Thermal Quenching on the Ferroelectric Al:HfO2 Thin Film with Record Polarization Density and Flash Memory Application
We have investigated the effects of post cooling process with chamber cooling, air cooling and fast quenching in DI water on the ferroelectric (FE) characteristics of Al-doped Hf02 (Al:HfO2) thin films and demonstrated their potential flash memory applications. Compared with other cooling processes, using fast quenching after annealing we achieved the drastic increase of remnant polarization $(\mathrm{P}_{\mathrm{r}})$ and coercive electric field $(\mathrm{E}_{\mathrm{c}})$. The highest $2\mathrm{P}_{\mathrm{r}}$ and $2\mathrm{E}_{\mathrm{c}}$ are $\sim 100\mu\mathrm{C}/\mathrm{cm}^{2}$ and ~9.5 MV/cm, respectively, the highest records among HfO2-based FE reported so far. These improvements are attributed to induce higher stress/strain within A1:HfO2 thin film, leading to stable orthorhombic phase (o-phase). Program/erase up to 106 cycles and 10 years retention characteristics are also evaluated for the potential flash memory application. Our simulation with experimental data indicates that Pr and Ec significantly can influence on the memory window and multi-bit states, which can be tuned by our proposed quenching process.