衬底电导对电子元件冷却影响的研究

IF 1.1 Q4 THERMODYNAMICS

Frontiers in Heat and Mass Transfer Pub Date : 2022-08-17 DOI:10.5098/hmt.18.49

Shankar Durgam

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引用次数: 0

摘要

本文从实验和数值两方面探讨了电导对垂直散热通道内强制气流冷却电子芯片的影响。实验采用FR4、胶木、覆铜板(单层)等基材，在500≤Re≤1500条件下，分别以1000w / m2、2000w / m2和3000w / m2的均匀热流为热源进行。利用基于COMSOL Multiphysics 4.3b软件的有限元方法对实验结果进行了计算机模拟验证，结果吻合度在10%以下。所获得的温度表明，与FR4和电木基板相比，覆铜板(CCBs)的热导率非常低。结果表明，在风速为0.6 m/s、热流密度为3000 W/ m2时，FR4和电木不适合使用。然而，单层和多层CCB之间的温度变化是3到4◦C。与FR4和电木相比，使用CCB的温度降低了10°C。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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STUDY OF SUBSTRATE CONDUCTANCE EFFECT ON COOLING OF ELECTRONIC COMPONENTS

This article explores experimentally and numerically the effect of conductance on cooling of electronic chips by forced air ﬂow in a vertical channel for thermal control. Experiments are conducted using substrates of FR4, bakelite, copper clad board (single layer) equipped with aluminum heat sources at uniform heat ﬂuxes of 1000, 2000, and 3000 W/m 2 at 500 ≤ Re ≤ 1500. Computer simulations are performed to validate experimental results using a ﬁnite element method based COMSOL Multiphysics 4.3b software and the results are in agreements of below 10%. The temperatures obtained showed high thermal conductance copper clad boards (CCBs) are very low compared to FR4 and bakelite substrates. Results showed that FR4 and bakelite are unsuitable for airﬂow velocity of 0.6 m/s and heat ﬂux of 3000 W/m 2 . However, the temperature variation between single and multilayer CCB is 3 to 4 ◦ C . The temperature reduction using CCB is 10 ◦ C compared to FR4 and bakelite.

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来源期刊

Frontiers in Heat and Mass Transfer THERMODYNAMICS-

CiteScore

2.50

自引率

61.10%

发文量

审稿时长

10 weeks

期刊介绍： Frontiers in Heat and Mass Transfer is a free-access and peer-reviewed online journal that provides a central vehicle for the exchange of basic ideas in heat and mass transfer between researchers and engineers around the globe. It disseminates information of permanent interest in the area of heat and mass transfer. Theory and fundamental research in heat and mass transfer, numerical simulations and algorithms, experimental techniques and measurements as applied to all kinds of current and emerging problems are welcome. Contributions to the journal consist of original research on heat and mass transfer in equipment, thermal systems, thermodynamic processes, nanotechnology, biotechnology, information technology, energy and power applications, as well as security and related topics.