{"title":"杂质和晶粒尺寸对T3铜焊接性能的影响","authors":"Xueke Wang, S. Bao, Yongda Hu, Qiang Li, Libo Ai","doi":"10.1109/ICEPT.2016.7583398","DOIUrl":null,"url":null,"abstract":"X-ray fluorescence analyze, the milliohm meter and X-ray energy dispersive spectrometer were used to investigate the impurities and electric resistance of the copper wire. By the polishing and corrosion testing, the different grain sizes were observed by scanning electron microscopy. The impurities can effect on the hardness and electrical conductivity of the copper wire. The grain size also affects the hardness and plasticity. Consequently, the difference in impurities and grain sizes lead to the different welding performance.","PeriodicalId":6881,"journal":{"name":"2016 17th International Conference on Electronic Packaging Technology (ICEPT)","volume":"25 1","pages":"1454-1460"},"PeriodicalIF":0.0000,"publicationDate":"2016-08-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Effects of impurities and grain size on welding performance of T3 copper\",\"authors\":\"Xueke Wang, S. Bao, Yongda Hu, Qiang Li, Libo Ai\",\"doi\":\"10.1109/ICEPT.2016.7583398\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"X-ray fluorescence analyze, the milliohm meter and X-ray energy dispersive spectrometer were used to investigate the impurities and electric resistance of the copper wire. By the polishing and corrosion testing, the different grain sizes were observed by scanning electron microscopy. The impurities can effect on the hardness and electrical conductivity of the copper wire. The grain size also affects the hardness and plasticity. Consequently, the difference in impurities and grain sizes lead to the different welding performance.\",\"PeriodicalId\":6881,\"journal\":{\"name\":\"2016 17th International Conference on Electronic Packaging Technology (ICEPT)\",\"volume\":\"25 1\",\"pages\":\"1454-1460\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2016-08-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2016 17th International Conference on Electronic Packaging Technology (ICEPT)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ICEPT.2016.7583398\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2016 17th International Conference on Electronic Packaging Technology (ICEPT)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ICEPT.2016.7583398","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Effects of impurities and grain size on welding performance of T3 copper
X-ray fluorescence analyze, the milliohm meter and X-ray energy dispersive spectrometer were used to investigate the impurities and electric resistance of the copper wire. By the polishing and corrosion testing, the different grain sizes were observed by scanning electron microscopy. The impurities can effect on the hardness and electrical conductivity of the copper wire. The grain size also affects the hardness and plasticity. Consequently, the difference in impurities and grain sizes lead to the different welding performance.
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