锡掺杂纳米银的合成与低温烧结

Yujun Zhang, Hui Yu, Liangliang Li
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引用次数: 0

摘要

银纳米颗粒由于其低温烧结的特性,在电子封装中得到了广泛的应用。降低银纳米颗粒的熔点对获得更好的导电/热传导和机械强度具有重要意义。本文合成了大量尺寸小于10 nm的掺锡银纳米颗粒,EDS和XRD数据表明Sn原子进入Ag晶格。通过扫描电镜研究了不同温度下纳米颗粒的烧结性能,与纯银纳米颗粒相比,掺锡银纳米颗粒的聚结更大,表明锡有助于纳米颗粒的烧结。通过TGA和DSC实验对烧结过程进行了详细的研究。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Synthesis and low-temperature sintering of tin-doped silver nanoparticles
Ag nanoparticles have been widely used in electronic packaging due to their low-temperature sintering properties. It is important to lower the melting point of Ag nanoparticles to achieve a better electrical/thermal conduction and mechanical strength. In this paper, a large amount of Sn-doped Ag nanoparticles with a size less than 10 nm were synthesized and the EDS and XRD data showed that the Sn atoms entered the Ag lattice. The sintering properties of the nanoparticles baked at different temperatures was investigated by SEM and a larger coalescence was observed for the Sn-doped Ag nanoparticles compared to the pure Ag nanoparticles, indicating that Sn helped the sintering of the nanoparticles. TGA and DSC experiments were also carried out to study the sintering process in detail.
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