尺寸、孔径和端子对层合母线杂散电感的影响

Q3 Computer Science
Aravind Venugopal, F. Robert
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引用次数: 0

摘要

本文系统地研究了尺寸、孔径和端子等物理参数对母线电感的影响。采用基于三维有限元模型的仿真软件,对一种具有铜导体和聚酰胺绝缘子的平面层压母线进行了研究。考察了导体长度、宽度、厚度、绝缘子深度、孔数、尺寸、位置、接线端子等尺寸对母线电感的影响。分析了层合母线的磁通密度、电流密度及其与自互感的关系。通过减小导体长度、厚度、孔径和绝缘子深度,层压母线具有较低的电感。此外,母线宽度的增加是设计低电感母线的关键。低电感层压母线在电源变换器、电动汽车动力总成逆变器、光伏变换器等方面具有重要的应用价值。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Impact of Dimensions, Apertures and Terminals on Stray Inductance of the Laminated Busbar
This paper presents a systematic investigation of the impact of physical parameters such as dimensions, apertures and terminals, on the busbar inductance. A planar laminated busbar with copper conductors and a polyamide insulator is studied using a 3D FEM (Finite Element Modelling) based simulation software. The impact of dimensions such as conductor length, width and thickness, depth of insulator, the effects of aperture number, size, position and connection terminals on the busbar inductance are examined. The magnetic flux density, current density involved and its dependence on the self and mutual inductance of the laminated busbar is analyzed. Laminated busbars provided lower inductance with decreased conductor length, thickness, aperture diameter and depth of insulator. Also, the increased width of the busbar is of the essence for the design of a low inductance busbar. Low inductance laminated busbars are highly beneficial in power converters, powertrain inverters in electric vehicles, photovoltaic converters.
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来源期刊
Periodica polytechnica Electrical engineering and computer science
Periodica polytechnica Electrical engineering and computer science Engineering-Electrical and Electronic Engineering
CiteScore
2.60
自引率
0.00%
发文量
36
期刊介绍: The main scope of the journal is to publish original research articles in the wide field of electrical engineering and informatics fitting into one of the following five Sections of the Journal: (i) Communication systems, networks and technology, (ii) Computer science and information theory, (iii) Control, signal processing and signal analysis, medical applications, (iv) Components, Microelectronics and Material Sciences, (v) Power engineering and mechatronics, (vi) Mobile Software, Internet of Things and Wearable Devices, (vii) Solid-state lighting and (viii) Vehicular Technology (land, airborne, and maritime mobile services; automotive, radar systems; antennas and radio wave propagation).
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