基于电迁移和机械纳米操作的微纳米级电连接自下而上纳米组装

Praveen Kumar, V. Koledov, S. Gratowski, R. Pratap, A. Irzhak, A. Zhikharev, A. Orlov, P. Lega, S. Talukder, Sumit Kumar, Vijayendra Shashtri
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引用次数: 1

摘要

本文研究了自底向上纳米集成的电纳米触点发展的物理基础。提出了利用金属微纳米液滴的电迁移和纳米线的三维机械纳米操作制备电纳米触点的方法。纳米操作是由形状记忆合金复合材料制成的纳米镊子提供的。研究了激光辐射和加热作用下微丝的熔化过程。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Electrical Jointing at Micro- and Nanoscale by Electromigration and Mechanical Nano-Manipulation for Bottom-Up Nano-Assembling
In the report the physical basis of the development of electrical nano-contacts for bottom-up nanointegration are studied. For the fabrication of the electrical nano-contacts it is proposed to use the electromigration of micro - and -nano-drops of metals and 3D mechanical nanomanipulation of the nanowires. Nano-manipulation is provided by the usage of nanotweezers, produced from shape memory alloy composite. The process of the melting of the micro-wires was studied under the action of laser radiation and heating.
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