N. Collaert, A. Alian, A. Banerjee, Vikas Chauhan, R. ElKashlan, B. Hsu, M. Ingels, A. Khaled, K. Vondkar Kodandarama, B. Kunert, Y. Mols, U. Peralagu, V. Putcha, R. Rodriguez, A. Sibaja-Hernandez, E. Simoen, A. Vais, A. Walke, L. Witters, S. Yadav, H. Yu, M. Zhao, P. Wambacq, B. Parvais, N. Waldron
{"title":"从5G到6G:化合物半导体会产生影响吗?","authors":"N. Collaert, A. Alian, A. Banerjee, Vikas Chauhan, R. ElKashlan, B. Hsu, M. Ingels, A. Khaled, K. Vondkar Kodandarama, B. Kunert, Y. Mols, U. Peralagu, V. Putcha, R. Rodriguez, A. Sibaja-Hernandez, E. Simoen, A. Vais, A. Walke, L. Witters, S. Yadav, H. Yu, M. Zhao, P. Wambacq, B. Parvais, N. Waldron","doi":"10.1109/ICSICT49897.2020.9278253","DOIUrl":null,"url":null,"abstract":"In this work, we will address the opportunities of a hybrid III-V/CMOS technology for next generation wireless communication, beyond 5G, moving to operating frequencies above 100GHz. Challenges related to III-V upscaling and CMOS co-integration using 3D technologies will be discussed.","PeriodicalId":6727,"journal":{"name":"2020 IEEE 15th International Conference on Solid-State & Integrated Circuit Technology (ICSICT)","volume":"23 1","pages":"1-4"},"PeriodicalIF":0.0000,"publicationDate":"2020-11-03","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"5","resultStr":"{\"title\":\"From 5G to 6G: will compound semiconductors make the difference?\",\"authors\":\"N. Collaert, A. Alian, A. Banerjee, Vikas Chauhan, R. ElKashlan, B. Hsu, M. Ingels, A. Khaled, K. Vondkar Kodandarama, B. Kunert, Y. Mols, U. Peralagu, V. Putcha, R. Rodriguez, A. Sibaja-Hernandez, E. Simoen, A. Vais, A. Walke, L. Witters, S. Yadav, H. Yu, M. Zhao, P. Wambacq, B. Parvais, N. Waldron\",\"doi\":\"10.1109/ICSICT49897.2020.9278253\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"In this work, we will address the opportunities of a hybrid III-V/CMOS technology for next generation wireless communication, beyond 5G, moving to operating frequencies above 100GHz. Challenges related to III-V upscaling and CMOS co-integration using 3D technologies will be discussed.\",\"PeriodicalId\":6727,\"journal\":{\"name\":\"2020 IEEE 15th International Conference on Solid-State & Integrated Circuit Technology (ICSICT)\",\"volume\":\"23 1\",\"pages\":\"1-4\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2020-11-03\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"5\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2020 IEEE 15th International Conference on Solid-State & Integrated Circuit Technology (ICSICT)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ICSICT49897.2020.9278253\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2020 IEEE 15th International Conference on Solid-State & Integrated Circuit Technology (ICSICT)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ICSICT49897.2020.9278253","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
From 5G to 6G: will compound semiconductors make the difference?
In this work, we will address the opportunities of a hybrid III-V/CMOS technology for next generation wireless communication, beyond 5G, moving to operating frequencies above 100GHz. Challenges related to III-V upscaling and CMOS co-integration using 3D technologies will be discussed.
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