基于记忆过程中自发极化和陷阱电荷直接提取的HfO2 ffet的Vth窗口和可靠性再检验

R. Ichihara, Kunifumi Suzuki, H. Kusai, K. Ariyoshi, Keisuke Akari, Keisuke Takano, K. Matsuo, Y. Kamiya, Kota Takahashi, Hidenori Miyazawa, Y. Kamimuta, K. Sakuma, M. Saitoh
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引用次数: 20

摘要

我们利用一种新技术,通过对ffet在记忆过程中的一次性电流测量,提取自发极化$(\mathrm{P}_{\mathrm{s}})$和界面陷阱电荷$(\mathrm{Q}_{\mathrm{t}})$,重新研究了影响HfO2 ffet记忆窗口(MW)和可靠性的主要因素。不稳定的$\mathrm{Q}_{t}$(与铁电无关)对ffet的特性有很大的影响,它导致$\mathrm{V}_{\mathrm{th}}$不稳定,而稳定的$\mathrm{Q}_{1}$补偿了$\mathrm{P}_{\mathrm{s}}$产生的大部分电场(E)。稳定的$\mathrm{Q}_{\mathrm{t}}$与$\mathrm{P}_{\mathrm{s}}$以恒定的比例(~90%)耦合,将MW降低到远低于矫顽力电压$(\mathrm{V}_{\mathrm{c}})$的限制值。与传统模型不同,$\mathrm{P}_{\mathrm{s}}$增加和稳定化仍然有效地提高了分子量和保留率。在循环过程中,MW通过$\Delta \mathrm{P}_{\mathrm{s}}$的降低和补偿比$(\Delta \mathrm{Q}_{\mathrm{t}}/\Delta \mathrm{P}_{\mathrm{s}})$的增加而降低,补偿比$(\Delta \mathrm{P}_{\mathrm{s}})$可以通过接口$\mathrm{SiO}_{2}$抑制电荷注入/喷射。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Re-examination of Vth Window and Reliability in HfO2 FeFET Based on the Direct Extraction of Spontaneous Polarization and Trap Charge during Memory Operation
We re-examine the dominant factors of the memory window (MW) and reliability of HfO2 FeFET using a new technique to extract both spontaneous polarization $(\mathrm{P}_{\mathrm{s}})$ and interface trap charges $(\mathrm{Q}_{\mathrm{t}})$ by one-time current measurement of an FeFET during the memory operation. FeFET characteristics are strongly affected by unstable $\mathrm{Q}_{t}$ (unrelated to ferroelectric) which causes $\mathrm{V}_{\mathrm{th}}$ instability just after programming, and stable $\mathrm{Q}_{1}$ which compensates most of electric(E)- field generated by $\mathrm{P}_{\mathrm{s}}$. Stable $\mathrm{Q}_{\mathrm{t}}$ is coupled to $\mathrm{P}_{\mathrm{s}}$ with constant ratio (~90%), and reduce MW to the value much lower than the coercive voltage $(\mathrm{V}_{\mathrm{c}})$ limitation. Unlike the conventional model, $\mathrm{P}_{\mathrm{s}}$ increase and stabilization are still effective to improve MW and retention, respectively. During cycling, MW is degraded by $\Delta \mathrm{P}_{\mathrm{s}}$ reduction as well as the increase of the compensation ratio $(\Delta \mathrm{Q}_{\mathrm{t}}/\Delta \mathrm{P}_{\mathrm{s}})$ which can be mitigated by suppressing charge injection/ejection via interfacial $\mathrm{SiO}_{2}$.
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