{"title":"压力辅助陶瓷粘结剂喷射应力屏蔽特性研究","authors":"L. Kirby, F. Fei, Xuan Song","doi":"10.1115/msec2022-85766","DOIUrl":null,"url":null,"abstract":"\n Ceramic binder jetting processes have inherent limitations in achieving high density due to the low packing density of the powder bed. An emerging route to mitigate the low packing density in ceramic binder jetting entails uniaxial compaction of newly spread powder layers prior to ink deposition. The introduction of layerwise pressure induced a stress shielding effect, i.e., unbalanced stresses between the printed region saturated with ink and the surrounding loose powder, which generates heterogeneous stress in the powder bed and ultimately influences the density of the final part. In this paper, we attempt to better understand the stress shielding effect during the compaction of a selectively ink-jetted powder bed as a function of the printing pattern, i.e., ratio of printed to unprinted sector. Our findings reveal a decreased print area increased the resulting stress shielding effect. Additionally, when pressed without neighboring dry powder, a printed region experienced a much higher stress than the hybrid composition. The dry powder experienced the opposite effect, where when pressed alone, the dry powder had a much lower stress than when pressed with saturated powder. Findings will assist in density prediction and print pattern determination of compacted binder jetted ceramics.","PeriodicalId":45459,"journal":{"name":"Journal of Micro and Nano-Manufacturing","volume":null,"pages":null},"PeriodicalIF":1.0000,"publicationDate":"2022-06-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Characterization of Stress Shielding in Pressure-Assisted Ceramic Binder Jetting\",\"authors\":\"L. Kirby, F. Fei, Xuan Song\",\"doi\":\"10.1115/msec2022-85766\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"\\n Ceramic binder jetting processes have inherent limitations in achieving high density due to the low packing density of the powder bed. An emerging route to mitigate the low packing density in ceramic binder jetting entails uniaxial compaction of newly spread powder layers prior to ink deposition. The introduction of layerwise pressure induced a stress shielding effect, i.e., unbalanced stresses between the printed region saturated with ink and the surrounding loose powder, which generates heterogeneous stress in the powder bed and ultimately influences the density of the final part. In this paper, we attempt to better understand the stress shielding effect during the compaction of a selectively ink-jetted powder bed as a function of the printing pattern, i.e., ratio of printed to unprinted sector. Our findings reveal a decreased print area increased the resulting stress shielding effect. Additionally, when pressed without neighboring dry powder, a printed region experienced a much higher stress than the hybrid composition. The dry powder experienced the opposite effect, where when pressed alone, the dry powder had a much lower stress than when pressed with saturated powder. Findings will assist in density prediction and print pattern determination of compacted binder jetted ceramics.\",\"PeriodicalId\":45459,\"journal\":{\"name\":\"Journal of Micro and Nano-Manufacturing\",\"volume\":null,\"pages\":null},\"PeriodicalIF\":1.0000,\"publicationDate\":\"2022-06-27\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Journal of Micro and Nano-Manufacturing\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1115/msec2022-85766\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q4\",\"JCRName\":\"ENGINEERING, MANUFACTURING\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Journal of Micro and Nano-Manufacturing","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1115/msec2022-85766","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q4","JCRName":"ENGINEERING, MANUFACTURING","Score":null,"Total":0}
Characterization of Stress Shielding in Pressure-Assisted Ceramic Binder Jetting
Ceramic binder jetting processes have inherent limitations in achieving high density due to the low packing density of the powder bed. An emerging route to mitigate the low packing density in ceramic binder jetting entails uniaxial compaction of newly spread powder layers prior to ink deposition. The introduction of layerwise pressure induced a stress shielding effect, i.e., unbalanced stresses between the printed region saturated with ink and the surrounding loose powder, which generates heterogeneous stress in the powder bed and ultimately influences the density of the final part. In this paper, we attempt to better understand the stress shielding effect during the compaction of a selectively ink-jetted powder bed as a function of the printing pattern, i.e., ratio of printed to unprinted sector. Our findings reveal a decreased print area increased the resulting stress shielding effect. Additionally, when pressed without neighboring dry powder, a printed region experienced a much higher stress than the hybrid composition. The dry powder experienced the opposite effect, where when pressed alone, the dry powder had a much lower stress than when pressed with saturated powder. Findings will assist in density prediction and print pattern determination of compacted binder jetted ceramics.
期刊介绍:
The Journal of Micro and Nano-Manufacturing provides a forum for the rapid dissemination of original theoretical and applied research in the areas of micro- and nano-manufacturing that are related to process innovation, accuracy, and precision, throughput enhancement, material utilization, compact equipment development, environmental and life-cycle analysis, and predictive modeling of manufacturing processes with feature sizes less than one hundred micrometers. Papers addressing special needs in emerging areas, such as biomedical devices, drug manufacturing, water and energy, are also encouraged. Areas of interest including, but not limited to: Unit micro- and nano-manufacturing processes; Hybrid manufacturing processes combining bottom-up and top-down processes; Hybrid manufacturing processes utilizing various energy sources (optical, mechanical, electrical, solar, etc.) to achieve multi-scale features and resolution; High-throughput micro- and nano-manufacturing processes; Equipment development; Predictive modeling and simulation of materials and/or systems enabling point-of-need or scaled-up micro- and nano-manufacturing; Metrology at the micro- and nano-scales over large areas; Sensors and sensor integration; Design algorithms for multi-scale manufacturing; Life cycle analysis; Logistics and material handling related to micro- and nano-manufacturing.