尺寸缩放和尺寸效应对超CMOS全自旋逻辑互连的影响

2021 IEEE International Interconnect Technology Conference (IITC) Pub Date : 2014-05-20 DOI:10.1109/IITC.2014.6831833

R. M. Iraei, P. Bonhomme, N. Kani, S. Manipatruni, D. Nikonov, I. Young, A. Naeemi

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引用次数: 8

摘要

对全自旋逻辑(ASL)互连的每比特能量和延迟进行了建模。本文考虑了铝和铜互连通道，并量化了尺寸效应和尺度缩放对其潜在性能的影响。预测尺寸效应对ASL互连的影响比电互连更严重。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Impact of dimensional scaling and size effects on beyond CMOS All-Spin Logic interconnects

The energy-per-bit and delay of All-Spin Logic (ASL) interconnects have been modeled. Both Al and Cu interconnect channels have been considered and the impact of size effects and dimensional scaling on their potential performance has been quantified. It is predicted that size effects will affect ASL interconnects more severely than electrical interconnects.

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来源期刊

2021 IEEE International Interconnect Technology Conference (IITC)

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