E. Hsieh, S. Chung, C. Tsai, R. Huang, C. Tsai, C. Liang
{"title":"先进应变硅CMOS器件饱和状态下载流子输运对随机掺杂诱导漏极电流变化的影响","authors":"E. Hsieh, S. Chung, C. Tsai, R. Huang, C. Tsai, C. Liang","doi":"10.1109/SNW.2012.6243345","DOIUrl":null,"url":null,"abstract":"The variation of saturation drain current (I<sub>d,sat</sub>), induced by the random dopant variation (RDF), has been extensively studied by a new multivariate analysis method. It was found that the variation of I<sub>d,sat</sub> is originated from V<sub>th,sat</sub> and saturation velocity (V<sub>sat</sub>), while the variation of V<sub>th,sat</sub> comes from the drain induced barrier lowering (DIBL). However, the experimental results shows that V<sub>sat</sub> dominates the variation of I<sub>d,sat</sub>. From the transport theory, V<sub>sat</sub> is further decomposed into V<sub>inj</sub> and B<sub>sat</sub>, showing that V<sub>inj</sub> is the dominant factor of I<sub>d,sat</sub> variation. The faster the V<sub>inj</sub> is, the less the I<sub>d,sat</sub> variation becomes. If one improves the injection velocity, then the variation of I<sub>d,sat</sub> can be suppressed. This has been one of the significant benefits of strained silicon technology in CMOS device scaling.","PeriodicalId":6402,"journal":{"name":"2012 IEEE Silicon Nanoelectronics Workshop (SNW)","volume":null,"pages":null},"PeriodicalIF":0.0000,"publicationDate":"2012-06-10","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":"{\"title\":\"The impact of the carrier transport on the random dopant induced drain current variation in the saturation regime of advanced strained-silicon CMOS devices\",\"authors\":\"E. Hsieh, S. Chung, C. Tsai, R. Huang, C. Tsai, C. Liang\",\"doi\":\"10.1109/SNW.2012.6243345\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"The variation of saturation drain current (I<sub>d,sat</sub>), induced by the random dopant variation (RDF), has been extensively studied by a new multivariate analysis method. It was found that the variation of I<sub>d,sat</sub> is originated from V<sub>th,sat</sub> and saturation velocity (V<sub>sat</sub>), while the variation of V<sub>th,sat</sub> comes from the drain induced barrier lowering (DIBL). However, the experimental results shows that V<sub>sat</sub> dominates the variation of I<sub>d,sat</sub>. From the transport theory, V<sub>sat</sub> is further decomposed into V<sub>inj</sub> and B<sub>sat</sub>, showing that V<sub>inj</sub> is the dominant factor of I<sub>d,sat</sub> variation. The faster the V<sub>inj</sub> is, the less the I<sub>d,sat</sub> variation becomes. If one improves the injection velocity, then the variation of I<sub>d,sat</sub> can be suppressed. This has been one of the significant benefits of strained silicon technology in CMOS device scaling.\",\"PeriodicalId\":6402,\"journal\":{\"name\":\"2012 IEEE Silicon Nanoelectronics Workshop (SNW)\",\"volume\":null,\"pages\":null},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2012-06-10\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"1\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2012 IEEE Silicon Nanoelectronics Workshop (SNW)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/SNW.2012.6243345\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2012 IEEE Silicon Nanoelectronics Workshop (SNW)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/SNW.2012.6243345","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
The impact of the carrier transport on the random dopant induced drain current variation in the saturation regime of advanced strained-silicon CMOS devices
The variation of saturation drain current (Id,sat), induced by the random dopant variation (RDF), has been extensively studied by a new multivariate analysis method. It was found that the variation of Id,sat is originated from Vth,sat and saturation velocity (Vsat), while the variation of Vth,sat comes from the drain induced barrier lowering (DIBL). However, the experimental results shows that Vsat dominates the variation of Id,sat. From the transport theory, Vsat is further decomposed into Vinj and Bsat, showing that Vinj is the dominant factor of Id,sat variation. The faster the Vinj is, the less the Id,sat variation becomes. If one improves the injection velocity, then the variation of Id,sat can be suppressed. This has been one of the significant benefits of strained silicon technology in CMOS device scaling.