{"title":"超宽带、低损耗射频衬底,高密度直流路由,支持5G/6G倒装rfic","authors":"T. Smith, Bill Rhyne, Christopher Hatfield","doi":"10.4071/1085-8024-2021.1.000201","DOIUrl":null,"url":null,"abstract":"\n This paper presents the development of a substrate/interposer technology that is capable of supporting DC signal line routing down to <1mil trace and space densities, but also supports wideband, high-frequency and industry leading low loss RF routing from to beyond 175GHz. Building off of the proven performance and reliability of the PolyStrata® technology enabled air-coax routing, this paper discusses the development and addition of a redistribution technology that enables multilayer, high density DC signal routing at any point during the PolyStrata® process. This enhances the Polystrata® offering to a truly integrated substrate manufacturing process supporting high density interconnect requirement of flip-chip RF ICs as well as low loss high performance RF routing.\n The paper describes the design and fabrication of a demonstration part designed to accept a D-Band Flip-Chip RFIC. The chip side interconnects are 50um diameter copper pillar with solder cap, at 100um pitch with over 200 interconnects on a die. Multiple connections were required from 10Ghz to 175GHz as well has 30+ DC signal lines. The design can support this level of interconnect density and act as an interposer for next level interconnect to a printed circuit board. DC lines were routed out to a 400um pitch while RF interconnects can support transitions to micro-strip or strip-line PCB routing technology or waveguide, for easy and low loss interconnect to the next level system. An added benefit of being integrated into the PolyStrata® process is that high-performance passive components can be monolithically integrated into the interposer, and the demonstration vehicle implements a mmWave pass-band filter as well.","PeriodicalId":14363,"journal":{"name":"International Symposium on Microelectronics","volume":"50 1","pages":""},"PeriodicalIF":0.0000,"publicationDate":"2021-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Ultra wide-band, low Loss RF substrate with high-density DC routing supporting 5G/6G flip-chip RFICs\",\"authors\":\"T. Smith, Bill Rhyne, Christopher Hatfield\",\"doi\":\"10.4071/1085-8024-2021.1.000201\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"\\n This paper presents the development of a substrate/interposer technology that is capable of supporting DC signal line routing down to <1mil trace and space densities, but also supports wideband, high-frequency and industry leading low loss RF routing from to beyond 175GHz. Building off of the proven performance and reliability of the PolyStrata® technology enabled air-coax routing, this paper discusses the development and addition of a redistribution technology that enables multilayer, high density DC signal routing at any point during the PolyStrata® process. This enhances the Polystrata® offering to a truly integrated substrate manufacturing process supporting high density interconnect requirement of flip-chip RF ICs as well as low loss high performance RF routing.\\n The paper describes the design and fabrication of a demonstration part designed to accept a D-Band Flip-Chip RFIC. The chip side interconnects are 50um diameter copper pillar with solder cap, at 100um pitch with over 200 interconnects on a die. Multiple connections were required from 10Ghz to 175GHz as well has 30+ DC signal lines. The design can support this level of interconnect density and act as an interposer for next level interconnect to a printed circuit board. DC lines were routed out to a 400um pitch while RF interconnects can support transitions to micro-strip or strip-line PCB routing technology or waveguide, for easy and low loss interconnect to the next level system. An added benefit of being integrated into the PolyStrata® process is that high-performance passive components can be monolithically integrated into the interposer, and the demonstration vehicle implements a mmWave pass-band filter as well.\",\"PeriodicalId\":14363,\"journal\":{\"name\":\"International Symposium on Microelectronics\",\"volume\":\"50 1\",\"pages\":\"\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2021-10-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"International Symposium on Microelectronics\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.4071/1085-8024-2021.1.000201\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"International Symposium on Microelectronics","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.4071/1085-8024-2021.1.000201","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Ultra wide-band, low Loss RF substrate with high-density DC routing supporting 5G/6G flip-chip RFICs
This paper presents the development of a substrate/interposer technology that is capable of supporting DC signal line routing down to <1mil trace and space densities, but also supports wideband, high-frequency and industry leading low loss RF routing from to beyond 175GHz. Building off of the proven performance and reliability of the PolyStrata® technology enabled air-coax routing, this paper discusses the development and addition of a redistribution technology that enables multilayer, high density DC signal routing at any point during the PolyStrata® process. This enhances the Polystrata® offering to a truly integrated substrate manufacturing process supporting high density interconnect requirement of flip-chip RF ICs as well as low loss high performance RF routing.
The paper describes the design and fabrication of a demonstration part designed to accept a D-Band Flip-Chip RFIC. The chip side interconnects are 50um diameter copper pillar with solder cap, at 100um pitch with over 200 interconnects on a die. Multiple connections were required from 10Ghz to 175GHz as well has 30+ DC signal lines. The design can support this level of interconnect density and act as an interposer for next level interconnect to a printed circuit board. DC lines were routed out to a 400um pitch while RF interconnects can support transitions to micro-strip or strip-line PCB routing technology or waveguide, for easy and low loss interconnect to the next level system. An added benefit of being integrated into the PolyStrata® process is that high-performance passive components can be monolithically integrated into the interposer, and the demonstration vehicle implements a mmWave pass-band filter as well.