The effect of two different latent curing agents on the performance of anisotropic conductive adhesives

To explore the effect of two different latent curing agents on the performance of anisotropic conductive adhesive (ACA), two adhesive with different latent curing agents (ACA1 and ACA2) were prepared and flexible radio frequency identification (RFID) tag inlays were assembled with them through flip chip technology. Curing profile and thermal stability of the pastes, microstructures and the bonding strength of ACA bonding joints, room temperature and hot humidity storage capacity of inlays were studied. It was found that the type of curing agent had much effect on the performance of ACAs. The ACA using B as the latent curing agent (ACA2) had lower curing peak temperature although it had lower Tg and smaller curing rate than the former (ACA1). After it cured there was less air bubbles in the resin. And it had better bonding strength and anti hot-humidity capacity than the former from other tests. This was important to the reliability of product. Thus, as a whole, latent curing agent B is more suitable to prepare the paste to assemble the flexible RFID tag inlays.