电子和声子如何促进材料系统中的传热

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引用次数: 0

摘要

现代电子产品的复杂性和需求的增加导致晶体管的尺寸逐渐减小,因为更小的晶体管具有更高的处理速度,更低的能耗,并且可以在更小的区域内封装更多的数量。然而,实现互连尺寸的并行减小要困难得多。导线越细,电导率就越低,能量就会以热的形式散失,从而限制了集成电路的性能、可靠性和效率。因此,改善互连的热性能是集成电子学的核心挑战之一,也是未来基于纳米技术的替代计算方法发展的关键,包括自旋电子学(利用电子的自然磁性及其电荷来生产更快的计算机)和神经形态计算(一种受人脑结构和功能启发的计算方法)。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
How electrons and phonons promote heat transfer in material systems
NANOSCALE ELECTRONICS The increasing complexity and demands of modern electronics have resulted in a progressive reduction in the size of the transistors, as smaller transistors have higher processing speed, lower energy consumption, and they can be packed in larger numbers within smaller areas. A parallel reduction in interconnect sizes has however been far more difficult to achieve. As the wires are made thinner, their electrical conductivity decreases, and energy is dissipated in the form of heat, which can limit the performance, reliability, and efficiency of an integrated circuit. Improving the thermal properties of interconnects is therefore one of the central challenges in integrated electronics and for enabling the development of future alternative computing approaches based on nanotechnology, including spintronics (taking advantage of the natural magnetism of electrons, as well as their charge, to produce faster computers) and neuromorphic computing (a computing approach inspired by the structure and function of the human brain).
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