采用面积和功率优化的硬倍频发生器的基数8模2n乘法器

IF 1.1 4区 计算机科学 Q4 COMPUTER SCIENCE, HARDWARE & ARCHITECTURE
Naveen Kr. Kabra, Zuber M. Patel
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引用次数: 3

摘要

模2n乘法器在余数系统处理器的设计中起着至关重要的作用。当采用基数-8位编码技术设计这类乘法器时,硬倍频发生器在面积、功率和时延方面都是至关重要的。本文提出了一种用于该类发电机的面积和功率优化技术,并将其应用于模2n乘法器中以提高其性能。所提出的硬乘数生成器(HMG)只使用了≤log2n≤2的前缀级别和总前缀操作符。所提出的架构的综合是使用通用工艺设计套件-45纳米技术的Cadence工具完成的。HMG合成后的面积和功耗分别节省20.27% ~ 36.57%、2.43% ~ 18.41%,HMG布局后的面积和功耗分别节省20.01% ~ 35.26%、1.33% ~ 29.44%。优化后的HMG模2倍法器布局结果显示,面积、功耗、开关能量和面积延迟积分别节省7.88% ~ 10.04%、7.87% ~ 12.50%、3.09% ~ 11.29%和3.11% ~ 8.79%。
本文章由计算机程序翻译,如有差异,请以英文原文为准。

A radix-8 modulo 2n multiplier using area and power-optimized hard multiple generator

A radix-8 modulo 2n multiplier using area and power-optimized hard multiple generator

The moduli 2n multiplier plays a vital role in the design of a residue number system processor. When the radix-8 booth-encoded technique is adopted to design this kind of multipliers, the hard multiple generator is crucial in terms of area, power, and delay. This paper presents an area and power optimization technique for this kind of generators and its implementation in modulo 2n multiplier to improve the performance. The proposed hard multiplier generator (HMG) uses only ⌈log2n⌉-2 prefix levels and total prefix operators. The synthesis of the proposed architectures is done using the Cadence tool at Generic Process design Kit-45 nm technology. The post-synthesis result of HMG shows 20.27%–36.57%, 2.43%–18.41% saving in area and power, respectively, while the post-layout result of HMG shows 20.01%–35.26% and 1.33%–29.44% saving in area and power, respectively. The post-layout result of modulo 2nmultiplier using optimized HMG shows 7.88%–10.04%, 7.87%–12.50%, 3.09%–11.29%, and 3.11%–8.79% saving in area, power, switching energy and Area delay product, respectively.

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来源期刊
IET Computers and Digital Techniques
IET Computers and Digital Techniques 工程技术-计算机:理论方法
CiteScore
3.50
自引率
0.00%
发文量
12
审稿时长
>12 weeks
期刊介绍: IET Computers & Digital Techniques publishes technical papers describing recent research and development work in all aspects of digital system-on-chip design and test of electronic and embedded systems, including the development of design automation tools (methodologies, algorithms and architectures). Papers based on the problems associated with the scaling down of CMOS technology are particularly welcome. It is aimed at researchers, engineers and educators in the fields of computer and digital systems design and test. The key subject areas of interest are: Design Methods and Tools: CAD/EDA tools, hardware description languages, high-level and architectural synthesis, hardware/software co-design, platform-based design, 3D stacking and circuit design, system on-chip architectures and IP cores, embedded systems, logic synthesis, low-power design and power optimisation. Simulation, Test and Validation: electrical and timing simulation, simulation based verification, hardware/software co-simulation and validation, mixed-domain technology modelling and simulation, post-silicon validation, power analysis and estimation, interconnect modelling and signal integrity analysis, hardware trust and security, design-for-testability, embedded core testing, system-on-chip testing, on-line testing, automatic test generation and delay testing, low-power testing, reliability, fault modelling and fault tolerance. Processor and System Architectures: many-core systems, general-purpose and application specific processors, computational arithmetic for DSP applications, arithmetic and logic units, cache memories, memory management, co-processors and accelerators, systems and networks on chip, embedded cores, platforms, multiprocessors, distributed systems, communication protocols and low-power issues. Configurable Computing: embedded cores, FPGAs, rapid prototyping, adaptive computing, evolvable and statically and dynamically reconfigurable and reprogrammable systems, reconfigurable hardware. Design for variability, power and aging: design methods for variability, power and aging aware design, memories, FPGAs, IP components, 3D stacking, energy harvesting. Case Studies: emerging applications, applications in industrial designs, and design frameworks.
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