异构系统级包集成——趋势与挑战

2020 IEEE Symposium on VLSI Technology Pub Date : 2020-06-01 DOI:10.1109/VLSITechnology18217.2020.9265085

Frank J. C. Lee, Mei Wong, J. Tzou, J. Yuan, Daniel Chang, S. Rusu

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引用次数: 5

摘要

异构封装级集成在通用计算、机器学习和移动应用的高功能密度和低功耗处理器中发挥着越来越重要的作用。本文将回顾2.5D和3D封装级集成的技术趋势和挑战，特别关注芯片划分、电接口、功率传输、热建模和EDA流程的系统技术协同优化。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Heterogeneous System-Level Package Integration - Trends and Challenges

Heterogeneous package-level integration plays an increasing role in higher functional density and lower power processors for general computing, machine learning and mobile applications. This paper will review technology trends and challenges for 2.5D and 3D package-level integration with special focus on system-technology co-optimization of the die partitioning, electrical interfaces, power delivery, thermal modeling and EDA flows.

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来源期刊

2020 IEEE Symposium on VLSI Technology

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