Youngjae Kim, Jinho Hah, Patxi Fernandez-Zelaia, Sangil Lee, L. Christie, P. Houston, S. Melkote, K. Moon, C. Wong
{"title":"回流焊和热压缩焊(TCB)工艺制备无铅焊点的显微组织","authors":"Youngjae Kim, Jinho Hah, Patxi Fernandez-Zelaia, Sangil Lee, L. Christie, P. Houston, S. Melkote, K. Moon, C. Wong","doi":"10.1109/ECTC.2019.00324","DOIUrl":null,"url":null,"abstract":"Differences in microstructures of lead-free solder joints, Sn-Ag-Cu (96.5 wt./3.0 wt./0.5 wt.% SAC-305), made by two different semiconductor packaging processes such as reflow and TCB are discussed. Despite the enormous potential for TCB solder bonding process in microelectronic packaging, there has been few studies regarding the comparative analysis on electro-migration (EM) failure mechanism for the reflow process. We have systematically examined the EM-derived failures of the reflow and TCB-processed solder joints and demonstrated a process-structure-property linkage. This study also includes the analysis performed using generalized spherical harmonics (GSH) representation, a statistical and quantitative measure of material crystallographic informatics, which is novel in this field as to analyzing solder joint microstructures.","PeriodicalId":6726,"journal":{"name":"2019 IEEE 69th Electronic Components and Technology Conference (ECTC)","volume":"38 1","pages":"2349-2358"},"PeriodicalIF":0.0000,"publicationDate":"2019-05-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"3","resultStr":"{\"title\":\"Microstructures of Pb-Free Solder Joints by Reflow and Thermo-Compression Bonding (TCB) Processes\",\"authors\":\"Youngjae Kim, Jinho Hah, Patxi Fernandez-Zelaia, Sangil Lee, L. Christie, P. Houston, S. Melkote, K. Moon, C. Wong\",\"doi\":\"10.1109/ECTC.2019.00324\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Differences in microstructures of lead-free solder joints, Sn-Ag-Cu (96.5 wt./3.0 wt./0.5 wt.% SAC-305), made by two different semiconductor packaging processes such as reflow and TCB are discussed. Despite the enormous potential for TCB solder bonding process in microelectronic packaging, there has been few studies regarding the comparative analysis on electro-migration (EM) failure mechanism for the reflow process. We have systematically examined the EM-derived failures of the reflow and TCB-processed solder joints and demonstrated a process-structure-property linkage. This study also includes the analysis performed using generalized spherical harmonics (GSH) representation, a statistical and quantitative measure of material crystallographic informatics, which is novel in this field as to analyzing solder joint microstructures.\",\"PeriodicalId\":6726,\"journal\":{\"name\":\"2019 IEEE 69th Electronic Components and Technology Conference (ECTC)\",\"volume\":\"38 1\",\"pages\":\"2349-2358\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2019-05-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"3\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2019 IEEE 69th Electronic Components and Technology Conference (ECTC)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ECTC.2019.00324\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2019 IEEE 69th Electronic Components and Technology Conference (ECTC)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ECTC.2019.00324","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Microstructures of Pb-Free Solder Joints by Reflow and Thermo-Compression Bonding (TCB) Processes
Differences in microstructures of lead-free solder joints, Sn-Ag-Cu (96.5 wt./3.0 wt./0.5 wt.% SAC-305), made by two different semiconductor packaging processes such as reflow and TCB are discussed. Despite the enormous potential for TCB solder bonding process in microelectronic packaging, there has been few studies regarding the comparative analysis on electro-migration (EM) failure mechanism for the reflow process. We have systematically examined the EM-derived failures of the reflow and TCB-processed solder joints and demonstrated a process-structure-property linkage. This study also includes the analysis performed using generalized spherical harmonics (GSH) representation, a statistical and quantitative measure of material crystallographic informatics, which is novel in this field as to analyzing solder joint microstructures.
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