{"title":"基于电热驱动的SU-8微夹持器新设计","authors":"R. Voicu, R. Muller, L. Eftime","doi":"10.1109/SMICND.2008.4703369","DOIUrl":null,"url":null,"abstract":"A new design for a polymeric microgripper was developed. Two microgripper with different dimensions were considered. An evaluation between these models was performed using the simulation results. Finite-element analyses of the microgripper, using COVENTORWARE, are performed in order to evaluate the relation between the displacement, temperatures and the electrical current passing through the metallic layers.","PeriodicalId":6406,"journal":{"name":"2008 IEEE International Conference on Semiconductor Electronics","volume":"5 1","pages":"205-208"},"PeriodicalIF":0.0000,"publicationDate":"2008-12-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"A new design based on electro-thermally actuation for an SU-8 microgripper\",\"authors\":\"R. Voicu, R. Muller, L. Eftime\",\"doi\":\"10.1109/SMICND.2008.4703369\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"A new design for a polymeric microgripper was developed. Two microgripper with different dimensions were considered. An evaluation between these models was performed using the simulation results. Finite-element analyses of the microgripper, using COVENTORWARE, are performed in order to evaluate the relation between the displacement, temperatures and the electrical current passing through the metallic layers.\",\"PeriodicalId\":6406,\"journal\":{\"name\":\"2008 IEEE International Conference on Semiconductor Electronics\",\"volume\":\"5 1\",\"pages\":\"205-208\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2008-12-09\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2008 IEEE International Conference on Semiconductor Electronics\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/SMICND.2008.4703369\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2008 IEEE International Conference on Semiconductor Electronics","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/SMICND.2008.4703369","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
A new design based on electro-thermally actuation for an SU-8 microgripper
A new design for a polymeric microgripper was developed. Two microgripper with different dimensions were considered. An evaluation between these models was performed using the simulation results. Finite-element analyses of the microgripper, using COVENTORWARE, are performed in order to evaluate the relation between the displacement, temperatures and the electrical current passing through the metallic layers.
求助内容：
应助结果提醒方式：
京公网安备 11010802042870号
