{"title":"下填材料的最新进展","authors":"O. Suzuki","doi":"10.4071/2380-4505-2019.1.invitedaihardware000014","DOIUrl":null,"url":null,"abstract":"\n Invited Session on FUTURE SEMICONDUCTOR PACKAGES FOR AI HARDWARE. Outline: Applications for Advanced Packaging; Global AI Computing Hardware Total Available Market (TAM); Die partitions; Defect Density; FC-BGA Families Trends; Technical Challenges of CUF; Underfills for Advanced Packaging; Severe KOZ on MCM; Bleed Out; Formulation Technique; Concerns during penetration; Chip package interaction (CPI) Challenges; and summary.","PeriodicalId":14363,"journal":{"name":"International Symposium on Microelectronics","volume":"6 2 1","pages":""},"PeriodicalIF":0.0000,"publicationDate":"2019-12-19","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Recent Advances in Underfill Materials\",\"authors\":\"O. Suzuki\",\"doi\":\"10.4071/2380-4505-2019.1.invitedaihardware000014\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"\\n Invited Session on FUTURE SEMICONDUCTOR PACKAGES FOR AI HARDWARE. Outline: Applications for Advanced Packaging; Global AI Computing Hardware Total Available Market (TAM); Die partitions; Defect Density; FC-BGA Families Trends; Technical Challenges of CUF; Underfills for Advanced Packaging; Severe KOZ on MCM; Bleed Out; Formulation Technique; Concerns during penetration; Chip package interaction (CPI) Challenges; and summary.\",\"PeriodicalId\":14363,\"journal\":{\"name\":\"International Symposium on Microelectronics\",\"volume\":\"6 2 1\",\"pages\":\"\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2019-12-19\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"International Symposium on Microelectronics\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.4071/2380-4505-2019.1.invitedaihardware000014\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"International Symposium on Microelectronics","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.4071/2380-4505-2019.1.invitedaihardware000014","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Invited Session on FUTURE SEMICONDUCTOR PACKAGES FOR AI HARDWARE. Outline: Applications for Advanced Packaging; Global AI Computing Hardware Total Available Market (TAM); Die partitions; Defect Density; FC-BGA Families Trends; Technical Challenges of CUF; Underfills for Advanced Packaging; Severe KOZ on MCM; Bleed Out; Formulation Technique; Concerns during penetration; Chip package interaction (CPI) Challenges; and summary.
求助内容：
应助结果提醒方式：
京公网安备 11010802042870号
