传质芯片传质平台的设计与受力分析

Pingjuan Niu, Hao Sun, Liu Zhaofeng, Liu Qiang, Cao Shinan, Tian Haitao
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引用次数: 0

摘要

Micro LED是具有响应快、功耗低、可靠性高、寿命长的新一代显示屏。制造Micro LED的主要过程是将Micro LED芯片转移到电路板上。为了提高传质速度,设计了微型LED芯片传质平台,并对其工作原理进行了详细描述。建立了平台的三维视图,并对平台运行过程中芯片载体板的变形进行了分析。结果表明,该平台可以保证芯片的变形,并且在不需要摆臂的情况下可以提高传质速度。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Design And Force Analysis of The Chip Transfer Platform for Mass Transfer
Micro LED is a new generation displays with the fast response, low power consumption, high reliability and long life. The main process for the manufacture of the Micro LED is the transfer the Micro LED chips to the circuit boards. To improve the speed of the mass transfer, a Micro LED chips transfer platform was designed and the detailed description of the platforms work is presented. A 3D view of the platform is created, Than a analysis of the deformation of the chip carrier board during platform operation was been carried out. The result shows that the new platform can guarantee the deformation of the chips and the mass transfer speed can be improved as no need of the swing arm.
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