{"title":"级联h桥多电平变换器开路故障检测与定位方法综述","authors":"N. Gorla, S. K. Panda","doi":"10.1109/IECON43393.2020.9254851","DOIUrl":null,"url":null,"abstract":"Cascaded H-bridge (CHB) multilevel converter is widely used for medium voltage motor drives, Static Synchronous Compensator (STATCOMs) and solid-state transformers because of its advantages such as modular design, low harmonic distortion of input current and lower grid-side filter requirements compared to two-level converters. Among the failures in active devices, detection and localization of open-circuit (OC) faults either due to bond-wire lift off (device-side failures) or malfunction of gate driver (drive-side failures) are extensively studied. In this paper, fault detection and localization methods proposed in literature for CHB multilevel converters are analyzed and compared with respect to the time taken for fault localization and additional sensor requirements. For ease of understanding, the methods are classified as model-based, feature-based and hardware-based, and suitability of each classification is recommended for different applications.","PeriodicalId":13098,"journal":{"name":"IECON 2017 - 43rd Annual Conference of the IEEE Industrial Electronics Society","volume":"314 1","pages":"3988-3994"},"PeriodicalIF":0.0000,"publicationDate":"2020-10-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"4","resultStr":"{\"title\":\"Survey of Open-circuit Fault Detection and Localization Methods Applicable to Cascaded H-bridge Multilevel Converters\",\"authors\":\"N. Gorla, S. K. Panda\",\"doi\":\"10.1109/IECON43393.2020.9254851\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Cascaded H-bridge (CHB) multilevel converter is widely used for medium voltage motor drives, Static Synchronous Compensator (STATCOMs) and solid-state transformers because of its advantages such as modular design, low harmonic distortion of input current and lower grid-side filter requirements compared to two-level converters. Among the failures in active devices, detection and localization of open-circuit (OC) faults either due to bond-wire lift off (device-side failures) or malfunction of gate driver (drive-side failures) are extensively studied. In this paper, fault detection and localization methods proposed in literature for CHB multilevel converters are analyzed and compared with respect to the time taken for fault localization and additional sensor requirements. For ease of understanding, the methods are classified as model-based, feature-based and hardware-based, and suitability of each classification is recommended for different applications.\",\"PeriodicalId\":13098,\"journal\":{\"name\":\"IECON 2017 - 43rd Annual Conference of the IEEE Industrial Electronics Society\",\"volume\":\"314 1\",\"pages\":\"3988-3994\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2020-10-18\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"4\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"IECON 2017 - 43rd Annual Conference of the IEEE Industrial Electronics Society\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/IECON43393.2020.9254851\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"IECON 2017 - 43rd Annual Conference of the IEEE Industrial Electronics Society","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IECON43393.2020.9254851","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Survey of Open-circuit Fault Detection and Localization Methods Applicable to Cascaded H-bridge Multilevel Converters
Cascaded H-bridge (CHB) multilevel converter is widely used for medium voltage motor drives, Static Synchronous Compensator (STATCOMs) and solid-state transformers because of its advantages such as modular design, low harmonic distortion of input current and lower grid-side filter requirements compared to two-level converters. Among the failures in active devices, detection and localization of open-circuit (OC) faults either due to bond-wire lift off (device-side failures) or malfunction of gate driver (drive-side failures) are extensively studied. In this paper, fault detection and localization methods proposed in literature for CHB multilevel converters are analyzed and compared with respect to the time taken for fault localization and additional sensor requirements. For ease of understanding, the methods are classified as model-based, feature-based and hardware-based, and suitability of each classification is recommended for different applications.