聚酰亚胺基板上导电图案的超快激光直写

IF 1 Q4 ENGINEERING, MANUFACTURING
Ishrat Jahan Biswas, Enrique Contreras Lopez, F. Ahmed, Jianzhi Li
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引用次数: 0

摘要

激光直写(LDW)是一种在柔性聚合物基板上打印导电图案的快速、经济的方法。聚酰亚胺(PI)的电学、化学和机械性能使其成为激光书写导电电路的有吸引力的材料选择。电绝缘PI在柔性印刷电子产品中显示出巨大的潜力,因为LDW可以使这种材料的大部分选择性碳化,从而形成导电线路。然而,该领域的现有研究揭示了该方法的一些关键局限性,包括书面结构的有限导电性和碳化PI的脆弱性。因此,需要更多的研究来克服这些限制,并获得LDW方法在PI中编写柔性电子电路的好处。本研究探讨了提高飞秒激光在PI薄膜中书写体碳结构的电导率的潜在方法。通过改变脉冲能量、脉冲拾取器分频器和激光扫描舱口距离等关键工艺参数来改变激光能量的沉积,使碳结构的导电性最大化。实验结果表明,激光能量沉积对PI薄膜中导电碳结构有很强的依赖性。为了进一步提高激光书写结构的导电性,研究了在PI溶液中加入铜微粒并进行激光碳化的可行性。该方法在柔性电子电路和传感领域具有广泛的应用前景。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Ultrafast Laser Direct Writing of Conductive Patterns on Polyimide Substrate
Laser direct writing (LDW) is a fast and cost-effective method for printing conductive patterns in flexible polymer substrates. The electrical, chemical, and mechanical properties of polyimide (PI) make it an attractive material choice for laser writing of conductive circuits in such polymer. Electrically insulating PI has shown great potential for flexible printed electronics as LDW enables selective carbonization in the bulk of such material leading to the formation of conductive lines. However, existing studies in this area reveal a few key limitations of this approach including limited conductivity of written structures and fragility of carbonized PI. Therefore, more research is required to overcome those limitations and reap the benefits of the LDW approach in writing flexible electronic circuits in PI. The proposed study investigates potential approaches to enhance the electrical conductivity of femtosecond laser written bulk carbon structures in PI films. Deposition of laser energy was varied by changing key process parameters such as pulse energy, pulse picker divider, and hatch distance of laser scan to maximize the conductively of the carbon structure. The experimental findings show a strong dependency of laser energy deposition on the conductivity carbon structures in PI films. To further enhance the electrical conductivity of laser written structures, the feasibility of adding copper microparticles to the PI solution and subsequent laser carbonization was studied. The proposed LDW of conductive lines has potential in flexible electronic circuits and sensing applications.
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来源期刊
Journal of Micro and Nano-Manufacturing
Journal of Micro and Nano-Manufacturing ENGINEERING, MANUFACTURING-
CiteScore
2.70
自引率
0.00%
发文量
12
期刊介绍: The Journal of Micro and Nano-Manufacturing provides a forum for the rapid dissemination of original theoretical and applied research in the areas of micro- and nano-manufacturing that are related to process innovation, accuracy, and precision, throughput enhancement, material utilization, compact equipment development, environmental and life-cycle analysis, and predictive modeling of manufacturing processes with feature sizes less than one hundred micrometers. Papers addressing special needs in emerging areas, such as biomedical devices, drug manufacturing, water and energy, are also encouraged. Areas of interest including, but not limited to: Unit micro- and nano-manufacturing processes; Hybrid manufacturing processes combining bottom-up and top-down processes; Hybrid manufacturing processes utilizing various energy sources (optical, mechanical, electrical, solar, etc.) to achieve multi-scale features and resolution; High-throughput micro- and nano-manufacturing processes; Equipment development; Predictive modeling and simulation of materials and/or systems enabling point-of-need or scaled-up micro- and nano-manufacturing; Metrology at the micro- and nano-scales over large areas; Sensors and sensor integration; Design algorithms for multi-scale manufacturing; Life cycle analysis; Logistics and material handling related to micro- and nano-manufacturing.
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