下一代PCIe电气I/O向后兼容连接器

L. Shan, Daniel Freidman, Craig Kennedy, Warren Persak, K. Lau
{"title":"下一代PCIe电气I/O向后兼容连接器","authors":"L. Shan, Daniel Freidman, Craig Kennedy, Warren Persak, K. Lau","doi":"10.1109/ECTC.2018.00270","DOIUrl":null,"url":null,"abstract":"A backward compatible PCIe connector targeting 25-32Gb/s per-channel data rates was jointly developed under a collaboration between IBM Research and Amphenol Corporation. To demonstrate the improvement on loss/reflection/crosstalk, an evaluation board with both original and new PCIe connector footprints was designed, fabricated, and tested. 3D full-wave simulations were performed and correlated with measurement results. Optimal pad and ground configurations were used to update PCIe channel budget/specifications and provide design recommendations for potential PCIe Gen5 channels.","PeriodicalId":6555,"journal":{"name":"2018 IEEE 68th Electronic Components and Technology Conference (ECTC)","volume":"128 1","pages":"1798-1804"},"PeriodicalIF":0.0000,"publicationDate":"2018-05-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"4","resultStr":"{\"title\":\"Backward Compatible Connectors for Next Generation PCIe Electrical I/O\",\"authors\":\"L. Shan, Daniel Freidman, Craig Kennedy, Warren Persak, K. Lau\",\"doi\":\"10.1109/ECTC.2018.00270\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"A backward compatible PCIe connector targeting 25-32Gb/s per-channel data rates was jointly developed under a collaboration between IBM Research and Amphenol Corporation. To demonstrate the improvement on loss/reflection/crosstalk, an evaluation board with both original and new PCIe connector footprints was designed, fabricated, and tested. 3D full-wave simulations were performed and correlated with measurement results. Optimal pad and ground configurations were used to update PCIe channel budget/specifications and provide design recommendations for potential PCIe Gen5 channels.\",\"PeriodicalId\":6555,\"journal\":{\"name\":\"2018 IEEE 68th Electronic Components and Technology Conference (ECTC)\",\"volume\":\"128 1\",\"pages\":\"1798-1804\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2018-05-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"4\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2018 IEEE 68th Electronic Components and Technology Conference (ECTC)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ECTC.2018.00270\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2018 IEEE 68th Electronic Components and Technology Conference (ECTC)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ECTC.2018.00270","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 4

摘要

IBM研究院和安费诺公司联合开发了一种向后兼容的PCIe连接器,目标是每通道数据速率为25-32Gb/s。为了证明损耗/反射/串扰的改进,设计,制造和测试了具有原始和新的PCIe连接器足迹的评估板。进行了三维全波模拟,并与测量结果进行了对比。优化pad和ground配置用于更新PCIe通道预算/规格,并为潜在的PCIe Gen5通道提供设计建议。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Backward Compatible Connectors for Next Generation PCIe Electrical I/O
A backward compatible PCIe connector targeting 25-32Gb/s per-channel data rates was jointly developed under a collaboration between IBM Research and Amphenol Corporation. To demonstrate the improvement on loss/reflection/crosstalk, an evaluation board with both original and new PCIe connector footprints was designed, fabricated, and tested. 3D full-wave simulations were performed and correlated with measurement results. Optimal pad and ground configurations were used to update PCIe channel budget/specifications and provide design recommendations for potential PCIe Gen5 channels.
求助全文
通过发布文献求助,成功后即可免费获取论文全文。 去求助
来源期刊
自引率
0.00%
发文量
0
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
确定
请完成安全验证×
copy
已复制链接
快去分享给好友吧!
我知道了
右上角分享
点击右上角分享
0
联系我们:info@booksci.cn Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。 Copyright © 2023 布克学术 All rights reserved.
京ICP备2023020795号-1
ghs 京公网安备 11010802042870号
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术官方微信