{"title":"化学-机械刨平工艺用弹性抛光材料的研制","authors":"D. I. Terashkevich, E. S. Bokova, G. Kovalenko","doi":"10.35164/0554-2901-2023-3-4-44-48","DOIUrl":null,"url":null,"abstract":"The paper presents the results of the development of conditions for the production of elastic polishing materials based on solutions of polyethyruretanes, for the chemical-mechanical planarization of semiconductor silicon wafers.","PeriodicalId":20254,"journal":{"name":"Plasticheskie massy","volume":"34 1","pages":""},"PeriodicalIF":0.0000,"publicationDate":"2023-05-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Development of elastic polishing materials for the process of chemical-mechanical planarization\",\"authors\":\"D. I. Terashkevich, E. S. Bokova, G. Kovalenko\",\"doi\":\"10.35164/0554-2901-2023-3-4-44-48\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"The paper presents the results of the development of conditions for the production of elastic polishing materials based on solutions of polyethyruretanes, for the chemical-mechanical planarization of semiconductor silicon wafers.\",\"PeriodicalId\":20254,\"journal\":{\"name\":\"Plasticheskie massy\",\"volume\":\"34 1\",\"pages\":\"\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2023-05-23\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Plasticheskie massy\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.35164/0554-2901-2023-3-4-44-48\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Plasticheskie massy","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.35164/0554-2901-2023-3-4-44-48","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Development of elastic polishing materials for the process of chemical-mechanical planarization
The paper presents the results of the development of conditions for the production of elastic polishing materials based on solutions of polyethyruretanes, for the chemical-mechanical planarization of semiconductor silicon wafers.
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