用于高性能3D集成电路的3D堆叠微流控冷却

2012 IEEE 62nd Electronic Components and Technology Conference Pub Date : 2012-07-30 DOI:10.1109/ECTC.2012.6249058

Yue Zhang, A. Dembla, Y. Joshi, Muhannad S. Bakir

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引用次数: 42

摘要

散热是高性能大功率3D集成电路面临的重大挑战。本文介绍了嵌入式微流控冷却的三维集成电路的实验评价。不同的架构被实验地评估了隐藏:1)一个处理器上的内存堆栈。2)具有相同功耗的处理器对处理器堆栈，以及3)具有不同功耗的处理器对处理器堆栈，在所有情况下，嵌入式微流体冷却与空气冷却相比显着降低结温。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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3D stacked microfluidic cooling for high-performance 3D ICs

Cooling is a significant challenge for high-performance high-power 3D ICs. hi this paper, we describe the experimental evaluation of 3D ICs with embedded microfluidic cooling. Different architectures are experimentally evaluated ine hiding: 1) a memory-on-processor stack. 2) a processor-on-processor stack with equal power dissipation, and 3) a processor-on-processor stack with different power dissipation, hi all cases, embedded microfluidic cooling shows significant junction temperature reduction compared to air-cooling.

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2012 IEEE 62nd Electronic Components and Technology Conference

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