MBE埋入单晶硅化电极的高速硅PBT

T. Ohshima, N. Nakamura, K. Nakagawa, K. Yamaguchi, M. Miyao
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引用次数: 2

摘要

采用分子束外延(MBE)技术制备单晶硅/硅化物/硅双异质结构和亚微米尺寸硅化物薄膜,制备了埋置单晶电极的硅渗透基晶体管(pbt)。获得了50 mS/mm的高跨导和2*10/sup 4/ A/cm/sup 2/的高电流密度。最高单位电流增益频率(f/sub T/) 6ghz。计算机模拟表明,f/sub T/值是合理的,通过优化器件结构可以提高一个数量级以上(约120 GHz)。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
High speed Si PBT with buried single crystal silicide electrode by MBE
Silicon permeable base transistors (PBTs) with buried single-crystal electrodes were fabricated by developing formation techniques using molecular beam epitaxy (MBE) for obtaining single-crystal-Si/silicide/Si double-heterostructures and silicide films in submicron size patterns. A high transconductance of 50 mS/mm and high current density of 2*10/sup 4/ A/cm/sup 2/ were obtained. The highest unity current gain frequency (f/sub T/) 6 GHz. Computer simulations indicated that the value of f/sub T/ was reasonable and could be improved by more than one order of magnitude (about 120 GHz) by optimizing the device structure.<>
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