掩膜离子注入和闪光灯退火在Si中局部形成InAs纳米晶

L. Rebohle, R. Wutzler, S. Prucnal, R. Hübner, Y. Georgiev, A. Erbe, R. Böttger, M. Glaser, A. Lugstein, M. Helm, W. Skorupa
{"title":"掩膜离子注入和闪光灯退火在Si中局部形成InAs纳米晶","authors":"L. Rebohle, R. Wutzler, S. Prucnal, R. Hübner, Y. Georgiev, A. Erbe, R. Böttger, M. Glaser, A. Lugstein, M. Helm, W. Skorupa","doi":"10.1002/PSSC.201700188","DOIUrl":null,"url":null,"abstract":"The integration of high-mobility III–V compound semiconductors emerges as a promising route for Si device technologies to overcome the limits of further down-scaling. In this work, we investigate the possibilities to form InAs nanocrystals in a thin Si layer at laterally defined positions with the help of masked ion beam implantation and flash lamp annealing. In detail, a cladding layer was deposited on a silicon-on-insulator (SOI) wafer and patterned by electron beam lithography in order to serve as an implantation mask. The wafer was subsequently implanted with As and In, followed by flash lamp annealing leading to the formation of InAs nanoparticles in the implanted areas. The structures were investigated by Raman spectroscopy, scanning, and transmission electron microscopy as well as energy-dispersive X-ray spectroscopy. Depending on the size of the implantation window, several, one or no nanoparticle is formed. Finally, the perspectives for using this technique for the local modification of Si nanowires are discussed.","PeriodicalId":20065,"journal":{"name":"Physica Status Solidi (c)","volume":"23 1","pages":""},"PeriodicalIF":0.0000,"publicationDate":"2017-10-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"3","resultStr":"{\"title\":\"Local Formation of InAs Nanocrystals in Si by Masked Ion Implantation and Flash Lamp Annealing\",\"authors\":\"L. Rebohle, R. Wutzler, S. Prucnal, R. Hübner, Y. Georgiev, A. Erbe, R. Böttger, M. Glaser, A. Lugstein, M. Helm, W. Skorupa\",\"doi\":\"10.1002/PSSC.201700188\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"The integration of high-mobility III–V compound semiconductors emerges as a promising route for Si device technologies to overcome the limits of further down-scaling. In this work, we investigate the possibilities to form InAs nanocrystals in a thin Si layer at laterally defined positions with the help of masked ion beam implantation and flash lamp annealing. In detail, a cladding layer was deposited on a silicon-on-insulator (SOI) wafer and patterned by electron beam lithography in order to serve as an implantation mask. The wafer was subsequently implanted with As and In, followed by flash lamp annealing leading to the formation of InAs nanoparticles in the implanted areas. The structures were investigated by Raman spectroscopy, scanning, and transmission electron microscopy as well as energy-dispersive X-ray spectroscopy. Depending on the size of the implantation window, several, one or no nanoparticle is formed. Finally, the perspectives for using this technique for the local modification of Si nanowires are discussed.\",\"PeriodicalId\":20065,\"journal\":{\"name\":\"Physica Status Solidi (c)\",\"volume\":\"23 1\",\"pages\":\"\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2017-10-13\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"3\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Physica Status Solidi (c)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1002/PSSC.201700188\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Physica Status Solidi (c)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1002/PSSC.201700188","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 3

摘要

高迁移率III-V化合物半导体的集成成为硅器件技术克服进一步缩小尺寸限制的一条有前途的途径。在这项工作中,我们研究了在屏蔽离子束注入和闪光灯退火的帮助下,在横向定义位置的薄硅层中形成InAs纳米晶体的可能性。在绝缘体上硅(SOI)晶圆上沉积覆层,并通过电子束光刻进行图案化,作为植入掩膜。然后在晶圆上注入As和In,然后在闪光灯下退火,在注入区域形成InAs纳米颗粒。用拉曼光谱、扫描电镜、透射电镜和能量色散x射线光谱对其结构进行了研究。根据注入窗口的大小,可以形成几个、一个或没有纳米颗粒。最后,对该技术在硅纳米线局部修饰中的应用前景进行了展望。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Local Formation of InAs Nanocrystals in Si by Masked Ion Implantation and Flash Lamp Annealing
The integration of high-mobility III–V compound semiconductors emerges as a promising route for Si device technologies to overcome the limits of further down-scaling. In this work, we investigate the possibilities to form InAs nanocrystals in a thin Si layer at laterally defined positions with the help of masked ion beam implantation and flash lamp annealing. In detail, a cladding layer was deposited on a silicon-on-insulator (SOI) wafer and patterned by electron beam lithography in order to serve as an implantation mask. The wafer was subsequently implanted with As and In, followed by flash lamp annealing leading to the formation of InAs nanoparticles in the implanted areas. The structures were investigated by Raman spectroscopy, scanning, and transmission electron microscopy as well as energy-dispersive X-ray spectroscopy. Depending on the size of the implantation window, several, one or no nanoparticle is formed. Finally, the perspectives for using this technique for the local modification of Si nanowires are discussed.
求助全文
通过发布文献求助,成功后即可免费获取论文全文。 去求助
来源期刊
自引率
0.00%
发文量
0
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
确定
请完成安全验证×
copy
已复制链接
快去分享给好友吧!
我知道了
右上角分享
点击右上角分享
0
联系我们:info@booksci.cn Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。 Copyright © 2023 布克学术 All rights reserved.
京ICP备2023020795号-1
ghs 京公网安备 11010802042870号
Book学术文献互助
Book学术文献互助群
群 号:604180095
Book学术官方微信