{"title":"数码喷墨掩模印刷已进入时代","authors":"D. Milgrom","doi":"10.1109/IMPACT.2009.5382174","DOIUrl":null,"url":null,"abstract":"Digital Solder Mask Printing will bring a new era to both the PCB production and assembly processes. While maintaining the same performance, it shall allow cost reduction, yield improvement, PCB tracking and most importantly, an environmental friendly solution.","PeriodicalId":6410,"journal":{"name":"2009 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference","volume":"37 1","pages":"89-92"},"PeriodicalIF":0.0000,"publicationDate":"2009-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":"{\"title\":\"Evolving into the age of digital ink jet solder mask printing\",\"authors\":\"D. Milgrom\",\"doi\":\"10.1109/IMPACT.2009.5382174\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Digital Solder Mask Printing will bring a new era to both the PCB production and assembly processes. While maintaining the same performance, it shall allow cost reduction, yield improvement, PCB tracking and most importantly, an environmental friendly solution.\",\"PeriodicalId\":6410,\"journal\":{\"name\":\"2009 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference\",\"volume\":\"37 1\",\"pages\":\"89-92\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2009-10-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"1\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2009 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/IMPACT.2009.5382174\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2009 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IMPACT.2009.5382174","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Evolving into the age of digital ink jet solder mask printing
Digital Solder Mask Printing will bring a new era to both the PCB production and assembly processes. While maintaining the same performance, it shall allow cost reduction, yield improvement, PCB tracking and most importantly, an environmental friendly solution.