V. Székely, S. Torok, É. Nikodemusz, G. Farkas, M. Rencz
{"title":"热瞬变的测量和评价","authors":"V. Székely, S. Torok, É. Nikodemusz, G. Farkas, M. Rencz","doi":"10.1109/IMTC.2001.928814","DOIUrl":null,"url":null,"abstract":"Thermal transient measurement is method for the characterisation of IC packages gaining increasing importance, The measurement of these transients requires dedicated equipment. The subsequent innovative evaluation method can be applied in other fields of measurement as well. The paper discusses the innovative hardware and software solutions of the problem.","PeriodicalId":68878,"journal":{"name":"Journal of Measurement Science and Instrumentation","volume":"519 1","pages":"210-215 vol.1"},"PeriodicalIF":0.0000,"publicationDate":"2001-05-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"31","resultStr":"{\"title\":\"Measurement and evaluation of thermal transients\",\"authors\":\"V. Székely, S. Torok, É. Nikodemusz, G. Farkas, M. Rencz\",\"doi\":\"10.1109/IMTC.2001.928814\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Thermal transient measurement is method for the characterisation of IC packages gaining increasing importance, The measurement of these transients requires dedicated equipment. The subsequent innovative evaluation method can be applied in other fields of measurement as well. The paper discusses the innovative hardware and software solutions of the problem.\",\"PeriodicalId\":68878,\"journal\":{\"name\":\"Journal of Measurement Science and Instrumentation\",\"volume\":\"519 1\",\"pages\":\"210-215 vol.1\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2001-05-21\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"31\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Journal of Measurement Science and Instrumentation\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/IMTC.2001.928814\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Journal of Measurement Science and Instrumentation","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IMTC.2001.928814","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Thermal transient measurement is method for the characterisation of IC packages gaining increasing importance, The measurement of these transients requires dedicated equipment. The subsequent innovative evaluation method can be applied in other fields of measurement as well. The paper discusses the innovative hardware and software solutions of the problem.
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