碱性电解质中自下而上的铜沉积

2021 IEEE International Interconnect Technology Conference (IITC) Pub Date : 2014-05-20 DOI:10.1109/IITC.2014.6831880

D. Josell, T. Moffat

{"title":"碱性电解质中自下而上的铜沉积","authors":"D. Josell, T. Moffat","doi":"10.1109/IITC.2014.6831880","DOIUrl":null,"url":null,"abstract":"Superconformal electrodeposition enables the fabrication of high aspect ratio interconnects that are ubiquitous in microelectronics. The Curvature Enhanced Accelerator Coverage (CEAC) mechanism captures the morphological and kinetic aspects of many “superfilling” processes for Damascene interconnect fabrication [1-4]. Present superfilling copper electrolytes are acidic. Alkaline chemistries might rely on a non-CEAC filling mechanism.","PeriodicalId":6823,"journal":{"name":"2021 IEEE International Interconnect Technology Conference (IITC)","volume":"306 1","pages":"281-284"},"PeriodicalIF":0.0000,"publicationDate":"2014-05-20","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"2","resultStr":"{\"title\":\"Bottom-up copper deposition in alkaline electrolytes\",\"authors\":\"D. Josell, T. Moffat\",\"doi\":\"10.1109/IITC.2014.6831880\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Superconformal electrodeposition enables the fabrication of high aspect ratio interconnects that are ubiquitous in microelectronics. The Curvature Enhanced Accelerator Coverage (CEAC) mechanism captures the morphological and kinetic aspects of many “superfilling” processes for Damascene interconnect fabrication [1-4]. Present superfilling copper electrolytes are acidic. Alkaline chemistries might rely on a non-CEAC filling mechanism.\",\"PeriodicalId\":6823,\"journal\":{\"name\":\"2021 IEEE International Interconnect Technology Conference (IITC)\",\"volume\":\"306 1\",\"pages\":\"281-284\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2014-05-20\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"2\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2021 IEEE International Interconnect Technology Conference (IITC)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/IITC.2014.6831880\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2021 IEEE International Interconnect Technology Conference (IITC)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IITC.2014.6831880","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}

引用次数: 2

摘要

超共形电沉积可以制造出在微电子领域普遍存在的高纵横比互连。曲率增强加速器覆盖(CEAC)机制捕获了大马士革互连制造中许多“超填充”过程的形态学和动力学方面[1-4]。目前超充铜电解质呈酸性。碱性化学可能依赖于非ceac填充机制。

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Bottom-up copper deposition in alkaline electrolytes

Superconformal electrodeposition enables the fabrication of high aspect ratio interconnects that are ubiquitous in microelectronics. The Curvature Enhanced Accelerator Coverage (CEAC) mechanism captures the morphological and kinetic aspects of many “superfilling” processes for Damascene interconnect fabrication [1-4]. Present superfilling copper electrolytes are acidic. Alkaline chemistries might rely on a non-CEAC filling mechanism.

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2021 IEEE International Interconnect Technology Conference (IITC)

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