作为高介电常数介电介质的高压溅射沉积在硅上的金属钆的等离子体氧化

M. Pampillón, P. C. Feijoo, E. Andrés, J. Fierro
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引用次数: 1

摘要

在高压下溅射金属钆靶,然后进行原位等离子体氧化,在硅表面沉积氧化钆薄膜。在相同的氧化条件下,研究了不同的金属沉积时间。利用辉光放电光谱分析了沉积条件。采用x射线光电子能谱、高分辨透射电镜和傅里叶变换红外光谱对氧化膜进行了表征。所制备的薄膜呈化学计量和无定形。金属绝缘体半导体结构由两种不同的金属栅极:钛和铂制成。在形成气体气氛中进行温度处理前后对器件进行了测量。Ti门控器件扫除SiOx中间层,而Pt门控器件无金属反应。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Plasma oxidation of metallic gadolinium deposited on silicon by high pressure sputtering as high permittivity dielectric
Gadolinium oxide thin films were deposited on Si by sputtering a metallic gadolinium target at high pressure followed by an in situ plasma oxidation. Different metal deposition times with the same oxidation conditions were studied. The deposition conditions were analyzed by means of glow discharge optical spectroscopy. The oxide films were characterized by X-ray photoelectron spectroscopy, high resolution transmission electron microscopy and Fourier transform infrared spectroscopy. The films resulted stoichiometric and amorphous. Metal-insulator-semiconductor structures were fabricated with two different metal gates: titanium and platinum. The devices were measured before and after temperature treatments in a forming gas atmosphere. The Ti gated devices scavenge the SiOx interlayer while the Pt ones show no metal reaction.
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