Ka波段正交换能器的3D打印

G. Addamo, O. Peverini, G. Virone, F. Paonessa, D. Manfredi, F. Calignano
{"title":"Ka波段正交换能器的3D打印","authors":"G. Addamo, O. Peverini, G. Virone, F. Paonessa, D. Manfredi, F. Calignano","doi":"10.1109/IMWS-AMP.2018.8457143","DOIUrl":null,"url":null,"abstract":"In this paper, the advance of an on-going research activity jointly developed by CNR-IEIIT, IIT and Politecnico di Torino in the design and SLM manufacturing of high performances microwave devices is reported. In particular, two prototypes of Ka-band Orthomode Transducers, based on a novel AM-oriented layout, are presented. All the component building blocks, such as, coupling junction, bends and twists are integrated in a single mechanical part suitable for 3D printing.","PeriodicalId":6605,"journal":{"name":"2018 IEEE MTT-S International Microwave Workshop Series on Advanced Materials and Processes for RF and THz Applications (IMWS-AMP)","volume":"36 1 1","pages":"1-3"},"PeriodicalIF":0.0000,"publicationDate":"2018-07-16","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"9","resultStr":"{\"title\":\"3D Printing of Ka band Orthomode Transducers\",\"authors\":\"G. Addamo, O. Peverini, G. Virone, F. Paonessa, D. Manfredi, F. Calignano\",\"doi\":\"10.1109/IMWS-AMP.2018.8457143\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"In this paper, the advance of an on-going research activity jointly developed by CNR-IEIIT, IIT and Politecnico di Torino in the design and SLM manufacturing of high performances microwave devices is reported. In particular, two prototypes of Ka-band Orthomode Transducers, based on a novel AM-oriented layout, are presented. All the component building blocks, such as, coupling junction, bends and twists are integrated in a single mechanical part suitable for 3D printing.\",\"PeriodicalId\":6605,\"journal\":{\"name\":\"2018 IEEE MTT-S International Microwave Workshop Series on Advanced Materials and Processes for RF and THz Applications (IMWS-AMP)\",\"volume\":\"36 1 1\",\"pages\":\"1-3\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2018-07-16\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"9\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2018 IEEE MTT-S International Microwave Workshop Series on Advanced Materials and Processes for RF and THz Applications (IMWS-AMP)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/IMWS-AMP.2018.8457143\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2018 IEEE MTT-S International Microwave Workshop Series on Advanced Materials and Processes for RF and THz Applications (IMWS-AMP)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IMWS-AMP.2018.8457143","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 9

摘要

本文报道了中国中央研究院- ieiit、IIT和都灵理工大学联合开展的一项高性能微波器件设计和SLM制造研究的进展。特别提出了两种基于新型am定向布局的ka波段正交换能器原型。所有组件构建块,如,耦合结,弯曲和扭转被集成在一个单一的机械部件适合3D打印。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
3D Printing of Ka band Orthomode Transducers
In this paper, the advance of an on-going research activity jointly developed by CNR-IEIIT, IIT and Politecnico di Torino in the design and SLM manufacturing of high performances microwave devices is reported. In particular, two prototypes of Ka-band Orthomode Transducers, based on a novel AM-oriented layout, are presented. All the component building blocks, such as, coupling junction, bends and twists are integrated in a single mechanical part suitable for 3D printing.
求助全文
通过发布文献求助,成功后即可免费获取论文全文。 去求助
来源期刊
自引率
0.00%
发文量
0
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
确定
请完成安全验证×
copy
已复制链接
快去分享给好友吧!
我知道了
右上角分享
点击右上角分享
0
联系我们:info@booksci.cn Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。 Copyright © 2023 布克学术 All rights reserved.
京ICP备2023020795号-1
ghs 京公网安备 11010802042870号
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术官方微信