{"title":"先进的双采样架构","authors":"M. Nicolaidis, M. Dimopoulos","doi":"10.1109/IOLTS.2016.7604685","DOIUrl":null,"url":null,"abstract":"Aggressive technology scaling has dramatic impact on process, voltage and temperature (PVT) variations; circuit aging and wearout; clock skews; sensitivity to EMI (e.g. crosstalk and ground bounce), sensitivity to radiation-induced SEUs SETs; as well as power dissipation and thermal constraints. The resulting high defect rates and design complexity, adversely affect fabrication yield and reliability.","PeriodicalId":6580,"journal":{"name":"2016 IEEE 22nd International Symposium on On-Line Testing and Robust System Design (IOLTS)","volume":"12 1","pages":"130-132"},"PeriodicalIF":0.0000,"publicationDate":"2016-07-04","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"3","resultStr":"{\"title\":\"Advanced double-sampling architectures\",\"authors\":\"M. Nicolaidis, M. Dimopoulos\",\"doi\":\"10.1109/IOLTS.2016.7604685\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Aggressive technology scaling has dramatic impact on process, voltage and temperature (PVT) variations; circuit aging and wearout; clock skews; sensitivity to EMI (e.g. crosstalk and ground bounce), sensitivity to radiation-induced SEUs SETs; as well as power dissipation and thermal constraints. The resulting high defect rates and design complexity, adversely affect fabrication yield and reliability.\",\"PeriodicalId\":6580,\"journal\":{\"name\":\"2016 IEEE 22nd International Symposium on On-Line Testing and Robust System Design (IOLTS)\",\"volume\":\"12 1\",\"pages\":\"130-132\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2016-07-04\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"3\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2016 IEEE 22nd International Symposium on On-Line Testing and Robust System Design (IOLTS)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/IOLTS.2016.7604685\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2016 IEEE 22nd International Symposium on On-Line Testing and Robust System Design (IOLTS)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IOLTS.2016.7604685","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Aggressive technology scaling has dramatic impact on process, voltage and temperature (PVT) variations; circuit aging and wearout; clock skews; sensitivity to EMI (e.g. crosstalk and ground bounce), sensitivity to radiation-induced SEUs SETs; as well as power dissipation and thermal constraints. The resulting high defect rates and design complexity, adversely affect fabrication yield and reliability.