An Investigation for Electromagnetic and Electrothermal coupling Characteristics of Hybrid Bond in Stacked Embedded DRAM with MRPIM

Wafer-to-wafer hybrid bonding technology is used to realize a DRAM array wafer and a logic wafer face-to-face connected with the advantages of a high density integration for high bandwidth and energy efficiency. With the proposed stacked embedded DRAM (SEDRAM), the electromagnetic crosstalk and the electrothermal performance of hybrid bonding via (HBV) are studied using the proposed Meshless radial point interpolation method (M-RPIM) to reduce the electromagnetic crosstalk and the thermal crosstalk of the array. A parallelogram layout which arranges the signal HBVs and the ground HBVs in parallelogram shows the crosstalk noise and the maximum temperature is reduced by 10% and 11% respectively. In addition, an advanced honeycomb arrangement with dummy HBVs array and the interleaving stacking TSV-HBV structure are also proposed to further improve the performance of the SEDRAM.