对封装部件进行封装装配过程评价

2009 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference Pub Date : 2009-10-01 DOI:10.1109/IMPACT.2009.5382226

K. C. Li, J. L. Ku, A. Lee, J.C.Y. Huang

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引用次数: 3

摘要

为了满足小型化的要求，封装对封装(PoP)器件在移动通信电子工业中受到越来越多的关注。采用3D集成电路封装技术，实现多种功能的更高集成度。这也同时减少了第二级互连期间PCB的尺寸。目前，系统制造商有两种主要的方法。第一种方法是从组件供应商处购买堆叠的PoP。另一种方法是在内部组装非堆叠的PoP组件。

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The evaluation of assembly process for package on package components

The Package on Package (PoP) component is getting attentions in mobile communication electronics industry to meet the miniaturization requirements. The 3D IC packaging technology is employed to achieve higher integrations for multiple functions. This also concurrently reduces the size of PCB during second level of interconnection. Currently, there are two major approaches for system manufactures. The first approach is to purchase the stacked PoP from component supplier. The alternative is to assemble the non-stacked PoP components in house.

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2009 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference

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