S. Purushothaman, S. Nitta, J. G. Ryan, C. Narayan, M. Krishnan, S. Cohen, S. Gates, S. Whitehair, J. Hedrick, C. Tyberg, S. Greco, K. Rodbell, E. Huang, T. Dalton, R. Dellaguardia, K. Saenger, E. Simonyi, S.T. Chen, K. Malone, R. Miller, W. Volksen
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Opportunities and challenges in ultra low k dielectrics for interconnect applications
In this paper, we discuss the challenges associated with producing, characterizing and integrating porous dielectrics into back-end-of-line (BEOL) interconnects and present results from our integration evaluations.
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