低dk特性与快速加工、低温固化相结合的5G先进封装介质材料

2020 IEEE 22nd Electronics Packaging Technology Conference (EPTC) Pub Date : 2020-12-02 DOI:10.1109/EPTC50525.2020.9315181

P. Miskiewicz, G. Larbig, G. Noya, J. Pradella, F. Meyer, M. Koch

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引用次数: 0

摘要

5G需求正在将现有材料推向极限。需要新材料来实现可靠高频元件的经济高效生产。默克已经建立了一个开发计划，以满足这些要求，结合可加工性，可靠性和产量。

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Combining low-dk properties with fast processing and low temperature curing for an advanced packaging dielectric material for 5G

5G requirements are pushing established materials to their limits. New materials are required to enable the cost-efficient production of reliable high frequency components. Merck has established a development program to meet these requirements with a combination of processability, reliability and yield.

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来源期刊

2020 IEEE 22nd Electronics Packaging Technology Conference (EPTC)

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