射流镀镍钨膜的特性研究

Yuka Tsuruta, Y. Umeda, H. Honma, O. Takai, K. Tashiro
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引用次数: 0

摘要

镀铬具有优良的耐腐蚀性,在工业上得到了广泛的应用。然而,它也有很高的环境负荷。作为一种替代方案,电镀镍钨引起了人们的关注。然而,由于应力高,薄膜容易开裂,因此没有得到广泛应用。此外,虽然需要加厚薄膜以提高耐腐蚀性,但也存在电流效率低、电镀时间长等问题。因此,我们研究了一种具有高耐蚀性的薄膜,采用射流镀法,可以在高电流密度下镀。结果表明,射流镀能使镀层厚度达到50µm,在20 A·dm−2的温度下,镀层随机产生细小裂纹,具有较高的耐蚀性。我们还发现应力随电流密度的变化而变化,裂纹的形状也发生了变化。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Features of Ni-W Plating Film Obtained by the Jet-Flow System
Chromium plating has excellent corrosion resistance and is widely used in industry. However, it also has a high environmental load. As an alternative, electric Ni-W plating is attracting attention. However, it is not widely used because the stress is high and the film is prone to cracks. Furthermore, although it is necessary to thicken the film to improve the corrosion resistance, there are also problems that the current efficiency is low and the plating time is long. Therefore, we investigate a film with high corrosion resistance by using the jet-flow plating method that enables plating at a high current density. Our results show that the jet-flow plating enables plating of 50 µm, and high corrosion resistance is obtained by randomly generating fine cracks in the film at 20 A·dm−2. We also found that the stress changed depending on the current density and shape of the crack also changed.
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