{"title":"硅纳米晶掺入对多晶硅纳米线SONOS器件传输特性的影响","authors":"Ko-Hui Lee, Horng-Chih Lin, Tiao-Yuan Huang","doi":"10.1109/SNW.2012.6243353","DOIUrl":null,"url":null,"abstract":"Gate-all-around poly-silicon nanowire (GAA poly-Si NW) SONOS devices embedded with silicon nanocrystals (Si-NCs) were fabricated and characterized. As Si-NCs are incorporated, the transfer characteristics show a large clockwise Id-Vg hysteresis and a small kink under reverse sweep. Si dangling bonds located at SiNC/nitride interfaces are suspected to be responsible for the observations.","PeriodicalId":6402,"journal":{"name":"2012 IEEE Silicon Nanoelectronics Workshop (SNW)","volume":null,"pages":null},"PeriodicalIF":0.0000,"publicationDate":"2012-06-10","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Impacts of silicon nanocrystal incorporation on the transfer characteristics of poly-silicon nanowire SONOS devices\",\"authors\":\"Ko-Hui Lee, Horng-Chih Lin, Tiao-Yuan Huang\",\"doi\":\"10.1109/SNW.2012.6243353\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Gate-all-around poly-silicon nanowire (GAA poly-Si NW) SONOS devices embedded with silicon nanocrystals (Si-NCs) were fabricated and characterized. As Si-NCs are incorporated, the transfer characteristics show a large clockwise Id-Vg hysteresis and a small kink under reverse sweep. Si dangling bonds located at SiNC/nitride interfaces are suspected to be responsible for the observations.\",\"PeriodicalId\":6402,\"journal\":{\"name\":\"2012 IEEE Silicon Nanoelectronics Workshop (SNW)\",\"volume\":null,\"pages\":null},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2012-06-10\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2012 IEEE Silicon Nanoelectronics Workshop (SNW)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/SNW.2012.6243353\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2012 IEEE Silicon Nanoelectronics Workshop (SNW)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/SNW.2012.6243353","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Impacts of silicon nanocrystal incorporation on the transfer characteristics of poly-silicon nanowire SONOS devices
Gate-all-around poly-silicon nanowire (GAA poly-Si NW) SONOS devices embedded with silicon nanocrystals (Si-NCs) were fabricated and characterized. As Si-NCs are incorporated, the transfer characteristics show a large clockwise Id-Vg hysteresis and a small kink under reverse sweep. Si dangling bonds located at SiNC/nitride interfaces are suspected to be responsible for the observations.