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无卤素衬底芯的发展趋势

2009 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference Pub Date : 2009-10-01 DOI:10.1109/IMPACT.2009.5382130
A. Huang, Kuo Liang Su, P. Liang, J. Lin
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引用次数: 0

摘要

大多数oem厂商已经宣布了他们在2008年使用非卤化电路板的计划，这一决定有助于加快无卤化基板芯的开发进度。
本文章由计算机程序翻译，如有差异，请以英文原文为准。
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The development trend of halogen-free substrate cores
A majority of OEMs have announced their plans to use non-halogenated circuit boards in 2008, and this decision has helped to accelerate the development schedule of halogen-free substrate cores.
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2009 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference
2009 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference
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