通过屏蔽氧化层注入引起的硼剖面反常展宽

C. Park, K. Klein, A. Tasch, R. Simonton, G. Lux
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引用次数: 11

摘要

通过对实验测量剖面和使用UT-MARLOWE代码的蒙特卡罗模拟结果的分析,研究了覆盖二氧化硅层对硼离子通道和植入剖面深度的影响。本文介绍了氧化层随机效应的细节,并揭示了一个令人惊讶的异常现象:通过屏蔽氧化层的植入实际上可以比在裸硅中类似的植入产生更宽(更深)的轮廓。研究发现,屏蔽氧化物对离子注入方向随机化的有效性在很大程度上依赖于离子能量和氧化物厚度之间的相关性。研究还表明,即使离子方向的完全随机化也不能完全消除离子通道。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Paradoxical boron profile broadening caused by implantation through a screen oxide layer
The effects of an overlaying silicon dioxide layer on boron ion channeling and implant profile depths have been examined through analysis of experimentally measured profiles and the results of Monte Carlo simulations using the UT-MARLOWE code. Details of the randomizing effects of the oxide layer are presented, and a surprising anomaly is revealed: implantations through screen oxide layers can actually result in broader (deeper) profiles than similar implantations into bare silicon. The effectiveness of the screen oxide in randomizing the directions of implanted ions was found to be strongly dependent on the correlation between the ion energy and the oxide thickness. It has also been shown that even the total randomization of the directions of the ions does not completely eliminate ion channeling.<>
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