镀微孔中的铜晶体结构。它们的再结晶和一种识别关节过早失效风险的方法

T. Bernhard, R. Massey, K. Klaeden, S. Zarwell, S. Kempa, E. Steinhaeuser, S. Dieter, F. Brüning
{"title":"镀微孔中的铜晶体结构。它们的再结晶和一种识别关节过早失效风险的方法","authors":"T. Bernhard, R. Massey, K. Klaeden, S. Zarwell, S. Kempa, E. Steinhaeuser, S. Dieter, F. Brüning","doi":"10.4071/1085-8024-2021.1.000292","DOIUrl":null,"url":null,"abstract":"\n Plated microvias are widely used within todays PCB industry as a means of achieving the high-density designs that are required in modern mobile devices, however, there has been growing concern regarding their long term reliability performance when stacked directly on top of each other.\n Blind microvias (BMV) have a potentially complex metallurgical structure, with several interfaces located around the target pad - electroless Copper - electrolytic Copper joint. While field experience as shown that there are typically two major types of crystal structures formed across the BMV base, there has been little reported work investigating how or why such structures develop. In this paper, we review these two commonly observed microstructures within filled BMVs and offer proposals on how such structures are created. We subsequently describe a novel means to indicate if the microstructure of a BMV is likely to have a tendency for an early onset of failure.","PeriodicalId":14363,"journal":{"name":"International Symposium on Microelectronics","volume":"107 1","pages":""},"PeriodicalIF":0.0000,"publicationDate":"2021-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Copper Crystal Structures in Plated Microvias. Their Recrystallisation and a Means to Identify Joints at Risk of Premature Failure\",\"authors\":\"T. Bernhard, R. Massey, K. Klaeden, S. Zarwell, S. Kempa, E. Steinhaeuser, S. Dieter, F. Brüning\",\"doi\":\"10.4071/1085-8024-2021.1.000292\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"\\n Plated microvias are widely used within todays PCB industry as a means of achieving the high-density designs that are required in modern mobile devices, however, there has been growing concern regarding their long term reliability performance when stacked directly on top of each other.\\n Blind microvias (BMV) have a potentially complex metallurgical structure, with several interfaces located around the target pad - electroless Copper - electrolytic Copper joint. While field experience as shown that there are typically two major types of crystal structures formed across the BMV base, there has been little reported work investigating how or why such structures develop. In this paper, we review these two commonly observed microstructures within filled BMVs and offer proposals on how such structures are created. We subsequently describe a novel means to indicate if the microstructure of a BMV is likely to have a tendency for an early onset of failure.\",\"PeriodicalId\":14363,\"journal\":{\"name\":\"International Symposium on Microelectronics\",\"volume\":\"107 1\",\"pages\":\"\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2021-10-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"International Symposium on Microelectronics\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.4071/1085-8024-2021.1.000292\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"International Symposium on Microelectronics","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.4071/1085-8024-2021.1.000292","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0

摘要

电镀微过孔作为实现现代移动设备所需的高密度设计的一种手段,在当今的PCB行业中被广泛使用,然而,当它们直接堆叠在彼此的上面时,人们越来越关注它们的长期可靠性性能。盲微孔(BMV)具有潜在的复杂的冶金结构,在靶焊盘-化学铜-电解铜接头周围分布着多个界面。虽然现场经验表明,在BMV基底上通常形成两种主要的晶体结构,但很少有研究这种结构如何或为什么形成的报道。在本文中,我们回顾了这两种常见的微观结构在填充bmv,并提出了如何创建这样的结构的建议。我们随后描述了一种新的方法来表明BMV的微观结构是否可能有早期失效的倾向。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Copper Crystal Structures in Plated Microvias. Their Recrystallisation and a Means to Identify Joints at Risk of Premature Failure
Plated microvias are widely used within todays PCB industry as a means of achieving the high-density designs that are required in modern mobile devices, however, there has been growing concern regarding their long term reliability performance when stacked directly on top of each other. Blind microvias (BMV) have a potentially complex metallurgical structure, with several interfaces located around the target pad - electroless Copper - electrolytic Copper joint. While field experience as shown that there are typically two major types of crystal structures formed across the BMV base, there has been little reported work investigating how or why such structures develop. In this paper, we review these two commonly observed microstructures within filled BMVs and offer proposals on how such structures are created. We subsequently describe a novel means to indicate if the microstructure of a BMV is likely to have a tendency for an early onset of failure.
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