模拟热局部表面沉积中初始单层的形成

Bart de Braaf, C. Rops, C. Storm
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引用次数: 2

摘要

在原子层沉积(ALD)中,在垂直方向上以原子层精度在衬底上沉积薄层材料。在横向方向上控制层生长的能力也有望大大增加ALD作为自下而上的电子设备(如太阳能电池板和有机发光二极管显示器)增材制造途径的潜力。我们探索了通过改变衬底上的温度分布来控制横向生长的可能性,例如,使用脉冲激光。这种无掩膜技术将大部分衬底保持在低温下,抑制其中一个化学半反应,而在一个小的局部区域,衬底被加热,这使得反应以更高的速率进行。我们用细粒度计算模型来验证这一想法,该模型模拟了各种照明方案对温度的控制,并模拟了在这种不均匀温度分布下初始单层的成核和生长。我们的研究结果表明,沉积的位置和程度原则上可以定位和控制,并解决可能获得细导电线的操作制度。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Modeling the initial monolayer formation in thermally localized surface deposition
In atomic layer deposition (ALD), thin layers of materials are deposited on a substrate with atomic layer precision in the vertical direction. The ability to control layer growth in the lateral direction as well is expected to greatly increase the potential of ALD as a path to the bottom-up additive fabrication of electronic devices like solar panels and organic light-emitting diode displays. We explore the possibility of controlling the lateral growth by modifying the temperature profile on the substrate using, for instance, pulsed lasers. This maskless technique keeps the majority of the substrate at a low temperature suppressing one of the chemical half-reactions, while in a small, localized area, the substrate is heated, which allows the reaction to proceed at a higher rate. We test this idea with course-grained computational models that model the control of the temperature by various illumination protocols and simulate the nucleation and growth of the initial monolayer within this inhomogeneous temperature distribution. Our results suggest that the location and the extent of deposition can, in principle, be localized and controlled and address operational regimes in which a thin conducting line may be obtained.
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