Introduction of Reverse Pyramid Configuration with Package Construction Characterization for Die Tilt Resolution of Highly Sensitive Multi-Stacked Dice Sensor Device

The paper focuses in addressing the die tilting issue of new device during new product introduction which consists of multi-stacked dice (two accelerometers plus one temperature sensor) during die attach process. All (100%) of qualification lots were affected with an average of 8000 defect parts per million (ppm) per lot. Die placement optimization, package construction characterization and simulation through Finite Element (FE) analysis were done, resulting to the reverse pyramid configuration of the device as the ultimate solution. This configuration validated and resolved the required die placement stability that resulted to elimination of die tilting issues from 8000 ppm to 0 ppm. For future works, the configuration could be applied for packages with similar construction.